# US 7,410,090 B2 · Conductive bonding material fill techniques > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,410,090 B2 - Document ID: US7410090B2 - Status: Granted - Kind: B2 - Application number: 11/409,244 - Filed: 2006-04-21 - Published: 2007-10-25 - Granted: 2008-08-12 - Earliest claimed: 2006-04-21 - Assignees: International Business Machines Corporation - Inventors: Steven A. Cordes; Peter A. Gruber; John U. Knickerbocker; James L. Speidell - Web page: https://patentgrep.com/patent/US7410090B2 ## CPC - H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12) - B23K 3/0607: {Solder feeding devices} - H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)} - B23K 2101/42: Printed circuits - H05K 2201/0305: Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns - H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component - H05K 2203/0126: Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes - H05K 2203/043: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste - H05K 2203/0568: Resist used for applying paste, ink or powder - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. ## Claims ### Claim 1 A method of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate, the method comprising: placing a fill head in substantial contact with a circuit supporting substrate, wherein the circuit supporting substrate includes at least one cavity; providing one of a linear motion and a rotational motion to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate; forcing conductive bonding material out of the fill head toward the circuit supporting substrate; providing the conductive bonding material into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head; and bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity, wherein the at least one receiving pad extends from a surface of the second circuit supporting substrate and at least a portion of the at least one receiving pad is inserted at least partially into the at least one cavity. ### Claim 2 (depends on 1) The method of claim 1, further comprising: heating the conductive bonding material in the at least one cavity to a reflow temperature thereby raising the conductive bonding material above the at least one cavity. ### Claim 3 (depends on 1) The method of claim 1, wherein the at least one cavity is formed by: providing a temporary layer across an outer surface of a circuit supporting substrate that is to receive conductive bonding material; and etching at least one cavity into the temporary layer for receiving the conductive bonding material, wherein the temporary layer is removed after the conductive bonding material is provided into the at least one cavity thereby leaving a conductive bonding material bump on the circuit supporting substrate. ### Claim 4 (depends on 1) The method of claim 1, wherein the at least one cavity is dimensionally configured differently than another cavity on the circuit supporting substrate. ### Claim 5 (depends on 1) The method of claim 1, wherein the conductive bonding material comprises solder. ### Claim 6 A method of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate, the method comprising: placing a fill head in substantial contact with a circuit supporting substrate, wherein the circuit supporting substrate includes at least one cavity; providing one of a linear motion and a rotational motion to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate; forcing conductive bonding material out of the fill head toward the circuit supporting substrate; providing the conductive bonding material into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head; bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity; and filling the at least one cavity such that at least one electrical contact in one or more layers of the at least one cavity is brought into electrical contact with the conductive bonding material in the at least one cavity, wherein the at least one electrical contact tenninates at a sidewall of the at least one cavity. ### Claim 7 (depends on 6) The method of claim 6, further comprising: bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity. ### Claim 8 (depends on 7) The method of claim 7, wherein the at least one receiving pad extends from a surface of the second circuit supporting substrate and at least a portion of the at least one receiving pad is inserted at least partially into the at least one cavity. ### Claim 9 (depends on 6) The method of claim 6, further comprising: heating the conductive bonding material in the at least one cavity to a reflow temperature thereby raising the conductive bonding material above the at least one cavity. ### Claim 10 (depends on 6) The method of claim 6, wherein the at least one cavity is formed by: providing a temporary layer across an outer surface of a circuit supporting substrate that is to receive conductive bonding material; and etching at least one cavity into the temporary layer for receiving the conductive bonding material, wherein the temporary layer is removed after the conductive bonding material is provided into the at least one cavity thereby leaving a conductive bonding material bump on the circuit supporting substrate. ### Claim 11 (depends on 6) The method of claim 6, wherein the at least one cavity is dimensionally configured differently than another cavity on the circuit supporting substrate. ### Claim 12 (depends on 6) The method of claim 6, wherein the conductive bonding material comprises solder. ### Claim 13 (depends on 6) The method of claim 6, further comprising: channeling a first gas about a first edge of the fill head, the first gas having a temperature above a melting point of the conductive bonding material thereby maintaining the conductive bonding material in a molten state as the conductive bonding material and the at least first gas are in close proximity to one another; and channeling a second gas about a second edge of the fill head, the second gas having a temperature below the melting point of the conductive bonding material thereby substantially solidifying the conductive bonding material within the at least one cavity as the at least one cavity passes under the second region of the fill head with the at least second gas. ### Claim 14 A method of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate, the method comprising; placing a fill head in substantial contact with a circuit supporting substrate, wherein the circuit supporting substrate includes at least one cavity; providing one of a linear motion and a rotational motion to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate; forcing conductive bonding material out of the fill head toward the circuit supporting substrate; providing the conductive bonding material into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head; bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving nad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity; channeling a first gas about a first edge of the fill head, the first gas having a temperature above a melting point of the conductive bonding material thereby maintaining the conductive bonding material in a molten state as the conductive bonding material and the at least first gas are in close proximity to one another; and channeling a second gas about a second edge of the fill head, the second gas having a temperature below the melting point of the conductive bonding material thereby substantially solidifying the conductive bonding material within the at least one cavity as the at least one cavity passes under the second region of the fill head with the at least second gas. ### Claim 15 (depends on 14) The method of claim 14, further comprising: bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity. ### Claim 16 (depends on 15) The method of claim 15, wherein the at least one receiving pad extends from a surface of the second circuit supporting substrate and at least a portion of the at least one receiving pad is inserted at least partially into the at least one cavity. ### Claim 17 (depends on 14) The method of claim 14, wherein the at least one cavity is formed by: providing a temporary layer across an outer surface of a circuit supporting substrate that is to receive conductive bonding material; and etching at least one cavity into the temporary layer for receiving the conductive bonding material, wherein the temporary layer is removed after the conductive bonding material is provided into the at least one cavity thereby leaving a conductive bonding material bump on the circuit supporting substrate. ### Claim 18 (depends on 14) The method of claim 14, wherein the at least one cavity is dimensionally configured differently than another cavity on the circuit supporting substrate. ### Claim 19 (depends on 14) The method of claim 14, wherein the conductive bonding material comprises solder. ### Claim 20 (depends on 14) The method of claim 14, further comprising: filling the at least one cavity such that at least one electrical contact in one or more layers of the at least one cavity is brought into electrical contact with the conductive bonding material in the at least one cavity, wherein the at least one electrical contact terminates at a sidewall of the at least one cavity.