# US 7,408,259 B2 · Sheet to form a protective film for chips

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 7,408,259 B2
- Document ID: US7408259B2
- Status: Granted
- Kind: B2
- Application number: 11/113,480
- Filed: 2005-04-25
- Published: 2005-08-25
- Granted: 2008-08-05
- Earliest claimed: 2001-03-21
- Assignees: Lintec Corporation
- Inventors: Hideo Senoo; Takashi Sugino; Osamu Yamazaki
- Web page: https://patentgrep.com/patent/US7408259B2

## CPC

- H10W 74/144: {the encapsulations comprising foils}
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10P 72/7416: {used during dicing or grinding}
- H10W 72/01331: {using blanket deposition}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/354: {comprising polymers}
- H10W 74/00: Encapsulations, e.g. protective coatings
- Y10T 428/14: Layer or component removable to expose adhesive
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

## Claims

### Claim 1

A sheet to form a protective film for chips which are mounted face down, consisting of a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting component and a binder polymer component.

### Claim 2 (depends on 1)

The sheet to form a protective film for chips according to claim 1, wherein the binder polymer component is composed of an acrylic polymer.

### Claim 3 (depends on 1)

The sheet to form a protective film for chips according to claim 1, wherein the thermosetting component is composed of an epoxy resin.

### Claim 4 (depends on 1)

The sheet to form a protective film for chips according to claim 1, wherein the protective film forming layer is colored.

### Claim 5 (depends on 1)

The sheet to form a protective film for chips according to claim 1, wherein the protective film forming layer further comprises a black pigment.