# US 7,408,255 B2 · Assembly for stacked BGA packages > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,408,255 B2 - Document ID: US7408255B2 - Status: Granted - Kind: B2 - Application number: 11/263,509 - Filed: 2005-10-31 - Published: 2006-03-23 - Granted: 2008-08-05 - Earliest claimed: 1998-06-30 - Assignees: Micron Technology, Inc. - Inventors: David J. Corisis; Walter L. Moden; Leonard E. Mess; Larry D. Kinsman - Web page: https://patentgrep.com/patent/US7408255B2 ## CPC - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H10W 70/688: {Flexible insulating substrates} - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 3/222: {Completing of printed circuits by adding non-printed jumper connections (printed jumper connections H05K3/4685)} - H05K 2201/10515: Stacked components - H05K 2201/1053: Mounted components directly electrically connected to each other, i.e. not via the PCB - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/68: Shapes or dispositions thereof - H10W 72/075: {of bond wires} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/551: {Materials of bond wires} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/865: {Die-attach connectors and bond wires} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W 72/951: {Materials of bond pads} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W 90/722: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices. ## Claims ### Claim 1 A densely stacked component assembly having at least a component mounted on a first substrate and at least another component mounted on a second substrate, the densely stacked component assembly comprising: a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof; a plurality of components, each component of the plurality having an active surface and a plurality of bond pads thereon, at least a portion of the active surface of each component secured to the first side of a first substrate of the plurality of first substrates, a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a component of the plurality of components; a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates; at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate; a jumper board having a first side, a second side, and at least one circuit thereon; a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit of the jumper board; and an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate. ### Claim 2 (depends on 1) The densely stacked component assembly of claim 1, wherein the second substrate includes at least one circuit on at least one of the first side and the second side thereof. ### Claim 3 (depends on 2) The densely stacked component assembly of claim 2, wherein at least one first substrate of the plurality is connected to the at least one circuit on the at least one of the first side and the second side of the second substrate. ### Claim 4 (depends on 1) The densely stacked component assembly of claim 1, wherein the plurality of first substrates is assembled in a first stack and a second stack on the first side of the second substrate. ### Claim 5 (depends on 4) The densely stacked component assembly of claim 4, further comprising: at least one connection between the at least one circuit on at least one first substrate in the first stack of first substrates and at least one of the at least two circuits of the second substrate; at least one connection between the at least one circuit on at least one first substrate in the second stack of first substrates and at least one other circuit of the at least two circuits of the second substrate; and a connection between one of the plurality of connection areas on the first side of a first substrate of the first stack of first substrates and the at least one circuit of the bus bar and a connection between one of the plurality of connection areas on the first side of a first substrate of the second stack of first substrates and the at least one circuit of the bus bar. ### Claim 6 (depends on 5) The densely stacked component assembly of claim 5, further comprising: an electrical component connected to at least two circuits on the second substrate. ### Claim 7 (depends on 1) The densely stacked component assembly of claim 1, wherein the electrical component includes a resistor. ### Claim 8 (depends on 7) The densely stacked component assembly of claim 7, wherein the resistor substantially affects the impedance of the one of the at least two circuits on the second substrate. ### Claim 9 (depends on 8) The densely stacked component assembly of claim 8, wherein the first stack of first substrates and the second stack of first substrates are included on each side of the second substrate. ### Claim 10 A stacked assembly having at least a component mounted on a first substrate and at least another component mounted on a second substrate, the stacked assembly comprising: a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof; a plurality of components, each component of the plurality having an active surface and a plurality of bond pads thereon, at least a portion of the active surface of each component secured to the first side of a first substrate of the plurality of first substrates, a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a component of the plurality of components; a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates; at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate; a jumper board having a first side, a second side, and at least one circuit thereon; a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit on the jumper board; and an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate. ### Claim 11 (depends on 10) The stacked assembly of claim 10, wherein the second substrate includes at least one circuit on at least one of the first side and the second side thereof. ### Claim 12 (depends on 11) The stacked assembly of claim 11, wherein at least one first substrate of the plurality is connected to the at least one circuit on the at least one of the first side and the second side of the second substrate. ### Claim 13 (depends on 10) The stacked assembly of claim 10, wherein the plurality of first substrates is assembled in a first stack and a second stack on the first side of the second substrate. ### Claim 14 (depends on 13) The stacked assembly of claim 13, further comprising: at least one connection between the at least one circuit on at least one first substrate in the first stack of first substrates and at least one of the at least two circuits of the second substrate; at least one connection between the at least one circuit on at least one first substrate in the second stack of first substrates and at least one other circuit of the at least two circuits of the second substrate; and a connection between one of the plurality of connection areas on the first side of a first substrate of the first stack of first substrates and the at least one circuit of the bus bar and a connection between one of the plurality of connection areas on the first side of a first substrate of the second stack of first substrates and the at least one circuit of the bus bar. ### Claim 15 (depends on 14) The stacked assembly of claim 14, further comprising: an electrical component connected to at least two circuits on the second substrate. ### Claim 16 (depends on 10) The stacked assembly of claim 10, wherein the electrical component includes a resistor. ### Claim 17 (depends on 16) The stacked assembly of claim 16, wherein the resistor substantially affects the impedance of the one of the at least two circuits on the second substrate. ### Claim 18 (depends on 17) The stacked assembly of claim 17, wherein the first stack of first substrates and the second stack of first substrates are included on each side of the second substrate. ### Claim 19 An assembly having a component mounted on a first substrate and another component mounted on a second substrate, the assembly comprising: a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof; a plurality of components, each component of the plurality having an active surface and a plurality of bond pads thereon, at least a portion of the active surface of each component secured to the first side of a first substrate of the plurality of first substrates, a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a component of the plurality of components; a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates; at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate; a jumper board having a first side, a second side, and at least one circuit thereon; a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit on the jumper board; and an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate.