# US 7,408,253 B2 · Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

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- Number: US 7,408,253 B2
- Document ID: US7408253B2
- Status: Granted
- Kind: B2
- Application number: 11/094,111
- Filed: 2005-03-30
- Published: 2006-10-12
- Granted: 2008-08-05
- Earliest claimed: 2005-03-30
- Inventors: Paul T. Lin
- Web page: https://patentgrep.com/patent/US7408253B2

## CPC

- H10W 90/00: Package configurations
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/688: {Flexible insulating substrates}
- H10W 70/40: Leadframes
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips}
- H10W 90/752: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention includes a chip-embedded support-frame wrapped-by-flex-circuit package assembly. The package assembly includes a flex circuit having a plurality of patterned connecting-traces. The package assembly further includes a plurality of semiconductor chips mounted on the flex circuits wherein the semiconductor chips having a plurality of contact terminals connected to corresponding connecting traces on the flex circuit. The package assembly further includes a support frame-board having an edge surface placed along predefined folded lines on the flex circuit. The frame-board has a plurality of open spaces for disposing each of the semiconductor chips therein. The flex circuit is provided for folding onto the support frame along the predefined folded lines to form the chip-embedded support-frame wrapped-by-flex-circuit package.

## Claims

### Claim 1

A chip-embedded support-frame wrapped-by-flex-circuit package assembly comprising:
a flex circuit having a plurality of patterned connecting-traces on a top surface and a bottom surface of said flex circuit
a plurality of semiconductor chips mounted on said flex circuits wherein said semiconductor chips having a plurality of contact terminals connected to corresponding connecting traces on said flex circuit;
a support frame having an edge surface placed along predefined folded lines on said flex circuit having a plurality of open spaces for disposing each of said semiconductor chips therein, wherein said flex circuit is provided for folding onto said support frame to form said chip-embedded support-frame wrapped-by-flex-circuit package;
said plurality of semiconductor chips mounted on said flex circuits are mounted on and connected to corresponding traces on said top surface and said bottom surface of said flex circuit.

### Claim 2 (depends on 1)

The package assembly of claim 1 wherein:
said flexible circuit is a laminated multiple-layered flexible circuit provided with via connections for inter-connection between multiple layers of said flexible circuit.

### Claim 3

A chip-embedded support-frame wrapped-by-flex-circuit package assembly comprising:
a flex circuit having a plurality of patterned connecting-traces;
a plurality of semiconductor chips mounted on said flex circuits wherein said semiconductor chips having a plurality of contact terminals connected to corresponding connecting traces on said flex circuit;
a support frame having an edge surface placed along predefined folded lines on said flex circuit having a plurality of open spaces for disposing each of said semiconductor chips therein, wherein said flex circuit is provided for folding onto said support frame to form said chip-embedded support-frame wrapped-by-flex-circuit package; and
said plurality of semiconductor chips mounted on said flex circuits are mounted on a top surface and a bottom surface of said laminated multiple-layered flex circuit and having contact terminals on said chips connected to corresponding connecting traces patterned on said laminated multiple-layered flex circuit.

### Claim 4 (depends on 1)

The package assembly of claim 1 wherein:
said chip-embedded frame-board wrapped by said flex circuit is a frame-board composed of heat conductive materials.

### Claim 5 (depends on 1)

The package assembly of claim 1 wherein:
said flex circuit further includes a plurality of edge contact strips disposed on edges of said flex circuit each connected to corresponding connecting traces.

### Claim 6

A chip-embedded support-frame wrapped-by-flex-circuit package assembly comprising:
a flex circuit having a plurality of patterned connecting-traces each connected to a corresponding edge contact strips disposed on edges of said flex circuit;
a plurality of semiconductor chips mounted on said flex circuits wherein said semiconductor chips having a plurality of contact terminals connected to corresponding connecting traces on said flex circuit;
a support frame-board having a plurality of open spaces;
said flex circuit further having folding lines for folding along an edge surface of said support frame board to warp around said support framed board for disposing each of said semiconductor chips in an open space on said support frame-board thus constituting said chip-embedded support-frame wrapped-by-flex-circuit package;
said flex circuit having a plurality of connecting traces on a top surface and a bottom surface of said flex circuit; and
said plurality of semiconductor chips mounted on said flex circuits are mounted on and connected to corresponding traces on said top surface and said bottom surface of said flex circuit.