# US 7,408,242 B2 · Carrier with reinforced leads that are to be connected to a chip

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- Number: US 7,408,242 B2
- Document ID: US7408242B2
- Status: Granted
- Kind: B2
- Application number: 10/139,344
- Filed: 2002-05-07
- Published: 2002-11-21
- Granted: 2008-08-05
- Earliest claimed: 2001-05-15
- Assignees: Oki Electric Industry Co., Ltd.
- Inventors: Syuichi Yamanaka; Tomiichi Shibata
- Web page: https://patentgrep.com/patent/US7408242B2

## CPC

- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 70/435: {of insulating layers on leadframes, e.g. bridging members}
- H10W 70/453: {comprising flexible metallic tapes}
- H10W 72/077: {Connecting of TAB connectors}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a base having a device hole and a plurality of leads for bonding a chip, the leads are provided with thin heat-resistant films.

## Claims

### Claim 1

A carrier for use with a chip, the carrier comprising a base having formed therein a hole for receiving the chip, a plurality of leads disposed on the base for bonding to the chip, and thin heat-resistant films provided over the base and the plurality of leads and extending beyond an edge of the hole, so as to adhere the leads around the periphery of the hole but not to cover end portions of the leads that are extended beyond the edge of the hole,
wherein the thin heat-resistant films are provided at portions of upper and side surfaces of the leads, the portions being in the vicinity of the edge of the hole,
wherein the thin heat-resistant films are further provided on lower surfaces of the leads at portions thereof which project into the hole, said portions not being areas of the leads for bonding to the chip, and
wherein the base comprises base tape.

### Claim 2 (depends on 1)

The carrier according to claim 1, wherein the portions of upper surfaces of the leads are portions that are not for bonding to the chip.

### Claim 3 (depends on 2)

The carrier according to claim 2, wherein the portions of side surfaces of the leads are portions that are not for bonding to the chip.

### Claim 4 (depends on 1)

The carrier according to claim 1, wherein the base tape comprises polyimide tape.

### Claim 5 (depends on 1)

The carrier according to claim 1, wherein the thin heat-resistant films are additionally provided:
on portions of the base between adjacent leads and on portions of the base in the vicinities of endmost leads.

### Claim 6 (depends on 1)

The carrier according to claim 1, wherein the thin heat-resistant film is further provided on a lower surface of the base.

### Claim 7 (depends on 1)

The carrier according to claim 1, wherein the thin heat-resistant films comprise a resin selected from a group consisting of polyimide resins, epoxy resins and urethane resins.

### Claim 8 (depends on 7)

The carrier according to claim 7, wherein the thin heat-resistant films comprise a polyimide resin.

### Claim 9 (depends on 7)

The carrier according to claim 7, wherein the thin heat-resistant films have a thickness of at least 10 μm.

### Claim 10 (depends on 1)

The carrier according to claim 1, wherein the thin heat-resistant films comprise pure nickel.

### Claim 11 (depends on 1)

A carrier according to claim 1, wherein the thin heat-resistant films have a uniform thickness.

### Claim 12 (depends on 1)

The carrier tape according to claim 1, wherein the hole has an area that is larger than the area of the chip, permitting the chip to be received within the hole when the leads are bonded to the chip.

### Claim 13 (depends on 12)

The carrier tape according to claim 12, wherein the lower surfaces of the leads are bonded to the chip.

### Claim 14 (depends on 1)

The carrier tape according to claim 1, wherein the lower surfaces of the leads are bonded to the chip.