# US 7,408,209 B2 · Semiconductor device with noise control

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- Number: US 7,408,209 B2
- Document ID: US7408209B2
- Status: Granted
- Kind: B2
- Application number: 11/304,212
- Filed: 2005-12-14
- Published: 2006-06-22
- Granted: 2008-08-05
- Earliest claimed: 2004-12-16
- Assignees: Canon Kabushiki Kaisha
- Inventors: Sou Hoshi
- Web page: https://patentgrep.com/patent/US7408209B2

## CPC

- H10W 20/427: {Power or ground buses}
- H10D 84/90: Masterslice integrated circuits
- H10D 84/998: {Input and output buffer/driver structures}
- H10W 72/90: Bond pads, in general
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

Radiation noise is reduced, and any operation error is prevented by suppressing noise propagation between an input/output circuit and an internal circuit while preventing or minimizing an increase in the number of steps of semiconductor element design. A semiconductor device having an input/output circuit region and an internal circuit region includes an internal circuit power supply cell which is arranged in the input/output circuit region and supplies a power to the internal circuit region, an internal circuit ground cell which is arranged in the input/output circuit region and supplies ground to the internal circuit region, and noise control cells which are arranged to sandwich the internal circuit power supply cell and the internal circuit ground cell in the input/output circuit region and formed by electrically connecting a p-type semiconductor substrate to ground independently of the input/output circuit region and the internal circuit region.

## Claims

### Claim 1

A semiconductor device having an input/output circuit region and an internal circuit region, comprising:
an internal circuit power supply cell which is arranged in the input/output circuit region and supplies a power to the internal circuit region;
an internal circuit ground cell which is arranged in the input/output circuit region and supplies ground to the internal circuit region; and
noise control cells which are formed from a p-type semiconductor substrate and are arranged to sandwich the internal circuit power supply cell and the internal circuit ground cell in the input/output circuit region and formed by electrically connecting the p-type semiconductor substrate to ground independently of the input/output circuit region and the internal circuit region.

### Claim 2 (depends on 1)

The device according to claim 1, further comprising ground ring wiring which electrically connects said noise control cells.

### Claim 3 (depends on 2)

The device according to claim 2, wherein said ground ring wiring is formed in an input/output cell arranged in the input/output circuit region.

### Claim 4 (depends on 2)

The device according to claim 2, wherein said ground ring wiring is arranged outside the input/output circuit region.

### Claim 5

A semiconductor device having an input/output circuit region and an internal circuit region, comprising:
an internal circuit power supply cell which is arranged in the input/output circuit region and supplies a power to the internal circuit region;
an internal circuit ground cell which is arranged in the input/output circuit region and supplies ground to the internal circuit region; and
noise control cells which are formed from an n-type semiconductor substrate and are arranged to sandwich the internal circuit power supply cell and the internal circuit ground cell in the input/output circuit region and formed by electrically connecting the n-type semiconductor substrate to a power supply independently of the input/output circuit region and the internal circuit region.

### Claim 6 (depends on 5)

The device according to claim 5, further comprising ground ring wiring which electrically connects said noise control cells.

### Claim 7 (depends on 6)

The device according to claim 6, wherein said ground ring wiring is formed in an input/output cell arranged in the input/output circuit region.

### Claim 8 (depends on 6)

The device according to claim 6, wherein said ground ring wiring is arranged outside the input/output circuit region.

### Claim 9

A semiconductor device having an input/output circuit region and an internal circuit region, comprising:
an input/output circuit arranged in the input/output circuit region;
an internal circuit arranged in the internal circuit region;
an internal circuit power supply portion which is arranged in the input/output circuit region and supplies a power to the internal circuit;
an internal circuit ground portion which is arranged in the input/output circuit region and supplies ground to the internal circuit; and
additional portions which are formed from a p-type semiconductor region and are arranged to sandwich the internal circuit power supply portion and the internal circuit ground portion in the input/output circuit region and electrically connecting the p-type semiconductor region to ground independently of the input/output circuit and the internal circuit.

### Claim 10

A semiconductor device having an input/output circuit region and an internal circuit region, comprising:
an input/output circuit arranged in the input/output circuit region;
an internal circuit arranged in the internal circuit region;
an internal circuit power supply portion which is arranged in the input/output circuit region and supplies a power to the internal circuit;
an internal circuit ground portion which is arranged in the input/output circuit region and supplies ground to the internal circuit; and
additional portions which are formed from an n-type semiconductor region and are arranged to sandwich the internal circuit power supply portion and the internal circuit ground portion in the input/output circuit region and formed by electrically connecting the n-type semiconductor region to a power supply independently of the input/output circuit and the internal circuit.