# US 7,408,207 B2 · Device manufacturing method and device, electro-optic device, and electronic equipment

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- Number: US 7,408,207 B2
- Document ID: US7408207B2
- Status: Granted
- Kind: B2
- Application number: 11/205,169
- Filed: 2005-08-17
- Published: 2005-12-22
- Granted: 2008-08-05
- Earliest claimed: 2003-01-23
- Assignees: Seiko Epson Corporation
- Inventors: Takashi Hashimoto; Atshushi Takakuwa; Tomoyuki Kamakura; Sumio Utsunomiya
- Web page: https://patentgrep.com/patent/US7408207B2

## CPC

- H10D 86/0214: {using temporary substrates}
- H10D 30/6758: {characterised by the insulating substrates}
- H10D 86/40: characterised by multiple TFTs
- H10D 86/60: wherein the TFTs are in active matrices
- H10D 86/80: characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support}
- H10P 72/7432: {used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.

## Claims

### Claim 1

A device comprising elements provided on a substrate, wherein
terminal sections are provided in an exposed condition on a surface of said elements on a substrate side, each element having a plurality of terminal sections;
conductive sections for conducting with corresponding terminal sections of said elements are provided on the surface of said substrate on the side where the elements are provided; and
said elements are adhered to said substrate by conductive adhesives comprising fine conductive particles dispersed in an insulative resin, which conduct between said terminal sections and corresponding said conductive sections, the conductive adhesives being formed in a condition of independence for each of the terminal sections, and being electrically insulated from each other, and wherein:
said terminal sections are parts of a gate electrode, a drain electrode, and a source electrode; and
said conductive adhesives bond the gate electrode, the drain electrode, and the source electrode onto the corresponding conductive sections on the substrate such that the gate electrode and the source electrodes are insulated with respect to each other.

### Claim 2 (depends on 1)

The device according to claim 1, wherein said conductive adhesives are anisotropic conductive adhesives.

### Claim 3 (depends on 1)

The device according to claim 1, wherein said conductive adhesives are in the independent condition by arranging the conductive adhesives separated for each of the respective terminal sections.

### Claim 4 (depends on 1)

The device according to claim 1, wherein said conductive adhesives are in the independent condition for each of the respective terminal sections by separating by an insulative partition.

### Claim 5 (depends on 1)

The device according to claim 1, wherein said conductive adhesives are in the independent condition for each of the respective terminal sections by arranging into respectively independent concavities.

### Claim 6 (depends on 1)

An electro-optic device equipped with a device according to claim 1.

### Claim 7 (depends on 1)

An electronic equipment equipped with a device according to claim 1.