Compound semiconductor particles and production process therefor
AssigneesMasakazu Kobayashi, Nippon Shokenbai Co., Ltd.
InventorsMasakazu Kobayashi, Mitsuo Takeda
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AssigneesMasakazu Kobayashi, Nippon Shokenbai Co., Ltd.
InventorsMasakazu Kobayashi, Mitsuo Takeda
Estimating the term…
There are provided: compound semiconductor particles that can display more excellent performance in functions peculiar to the compound semiconductor (e.g. luminosity and luminescence efficiency); and a production process for obtaining such compound semiconductor particles with economy, good productivity, and ease. Compound semiconductor particles, according to the present invention, are characterized by comprising body particles and a metal oxide, wherein the body particles have particle diameters of smaller than 1 μm and are covered with the metal oxide and include a compound semiconductor including an essential element combination of at least one element X selected from the group consisting of C, Si, Ge, Sn, Pb, N, P, As, Sb, S, Se, and Te and at least one metal element M that is not identical with the element X, and wherein the metal oxide is a metal oxide to which an acyloxyl group is bonded.
A production process for compound semiconductor particles, which comprises:
A production process for compound semiconductor particles, which comprises the steps of:
Compound semiconductor particles, which comprise body particles and a metal oxide, wherein the body particles have particle diameters of smaller than 1 μm and are covered with the metal oxide and include a compound semiconductor including an essential element combination of at least one element X selected from the group consisting of C, Si, Ge, Sn, Pb, N, P, As, S, Sb, Se, and Te and at least one metal element M that is not identical with the element X, and wherein the metal oxide is a metal oxide to which an acyloxyl group is bonded.
Dependencies are inferred from the claim text.