# US 7,407,826 B2 · Vacuum packaged single crystal silicon device

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- Number: US 7,407,826 B2
- Document ID: US7407826B2
- Status: Granted
- Kind: B2
- Application number: 11/322,842
- Filed: 2005-12-30
- Published: 2006-09-21
- Granted: 2008-08-05
- Earliest claimed: 2005-03-21
- Assignees: Honeywell International Inc.
- Inventors: Ijaz H. Jafri; Galen P. Magendanz
- Web page: https://patentgrep.com/patent/US7407826B2

## CPC

- B81C 1/00333: {Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325}
- B81C 1/00142: {Bridges (deformable micromirrors G02B26/0841)}
- H03H 3/0072: {of microelectro-mechanical resonators or networks (micromembranes or microbeams B81B2203/01; manufacture of microstructural devices in general B81C)}
- H03H 9/1057: {for microelectro-mechanical devices}
- H03H 9/2405: {of microelectro-mechanical resonators}
- H03H 9/2447: {Beam resonators (H03H9/2468 takes precedence)}
- H03H 9/462: {Microelectro-mechanical filters}
- B81B 2201/0271: Resonators; ultrasonic resonators
- B81C 2201/019: Bonding or gluing multiple substrate layers
- B81C 2203/036: Fusion bonding
- B81C 2203/051: Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
- H03H 2009/02511: {Vertical, i.e. perpendicular to the substrate plane}
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices.

## Claims

### Claim 1

A method for forming a hermetically sealed vibrating micromechanical structure, the method comprising:
micromachining one or more resonator structure anchors, a capacitive air gap, one or more isolation trenches, and one or more alignment marks in a single crystal silicon semiconductor material active layer of a first Silicon-On-Insulator wafer having a dielectric layer between a semiconductor material handle layer and the semiconductor material active layer;
fusion bonding a single crystal silicon semiconductor material active layer of a second Silicon-On-Insulator wafer directly to the active layer of the first Silicon-On-Insulator wafer, the second Silicon-On-Insulator wafer having a dielectric oxide layer between a semiconductor material handle layer and the semiconductor material active layer;
removing the handle and dielectric oxide layers of the second Silicon-On-Insulator wafer;
etching one or more windows in the active layer of the second Silicon-On-Insulator wafer;
silicon dry etch micromachining a single crystal silicon resonator structure in the single crystal silicon semiconductor material active layer of the second Silicon-On-Insulator wafer;
forming one or more contact pads on the active layer of the second Silicon-On-Insulator wafer;
forming a cover in a cover wafer having spaced apart top and bottom surfaces, forming the cover further comprising micromachining a plurality of access holes through the wafer between the spaced apart top and bottom surfaces with each of the access holes being positioned to align with a corresponding one of the contact pads formed on an outer surface of the active layer of the second Silicon-On-Insulator wafer; and
in a controlled atmosphere, bonding a cover to the active layer of the second Silicon-On-Insulator wafer over the resonator structure with the access holes aligned with the respective corresponding contact pad.

### Claim 2 (depends on 1)

The method of claim 1, further comprising forming the cover in a cover wafer formed of a semiconductor material, comprising: polycrystalline silicon semiconductor material, and single crystal silicon semiconductor material.

### Claim 3 (depends on 2)

The method of claim 2 wherein forming the cover further comprises:
micromachining a pattern of frit trenches in the wafer bottom surface, the pattern of frit trenches surrounding each of the access holes and surrounding an interior area of the wafer bottom surface corresponding to the resonator structure; and
further comprising screen printing of frit bonding material in the frit trenches; and
wherein bonding a cover to the active layer of the second Silicon-On-Insulator wafer over the resonator structure further comprises bonding of the cover by frit bonding the cover to the outer surface of the second resonator wafer active layer with the frit bonding material in the frit trenches surrounding the access holes being aligned with the respective contact pads and the frit bonding material in the frit trenches surrounding the interior area of the wafer bottom surface being aligned with the resonator structure.

### Claim 4 (depends on 3)

The method of claim 3, further comprising etching a clearance recess corresponding to the device resonator.

### Claim 5 (depends on 1)

The method of claim 1, further comprising: either before or after bonding cover to the active layer of the second Silicon-On-Insulator wafer, thinning the cover wafer by removing material of at least one of the top and bottom surfaces.

### Claim 6 (depends on 1)

The method of claim 1, further comprising depositing an electrically conductive metal trace in each of the access holes between the corresponding contact pad and a contact pad formed on the top surface of the cover.

### Claim 7 (depends on 1)

The method of claim 1 wherein the cover is further formed in a cover wafer formed of an insulating substrate material; and
wherein bonding a cover to the active layer of the second Silicon-On-Insulator wafer over the resonator structure further comprises bonding at least a portion of the wafer bottom surface of the cover to the outer surface of the second resonator wafer active layer in a bonding pattern in areas of the wafer bottom surface surrounding each of the access holes and surrounding an interior area of the wafer bottom surface substantially corresponding to the resonator structure, with the bonding pattern in the areas aligned with the respective contact pads and the bonding pattern surrounding the interior area aligned with the resonator structure.

### Claim 8 (depends on 1)

The method of claim 1 wherein forming the cover further comprises thinning the cover wafer; and
further comprising wire bonding electrical connections to the contact pads on the outer surface of the resonator wafer active layer.

### Claim 9 (depends on 1)

The method of claim 1, wherein machining at least the capacitive air gap comprises:
using a silicon nitride deposition over which a photolithographic pattern is formed using a photoresist masking material;
etching the silicon nitride;
stripping the photoresist masking material to create a silicon nitride mask over the active layer with a plurality of trenches forming the mask pattern;
performing a thermal oxidation to grow silicon oxide in the trenches; and
performing a silicon oxide/silicon nitride etch to create the capacitive air gap as a recess of very precise depth.