# US 7,407,608 B2 · Resin molding equipment and resin molding method

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- Number: US 7,407,608 B2
- Document ID: US7407608B2
- Status: Granted
- Kind: B2
- Application number: 11/262,851
- Filed: 2005-11-01
- Published: 2006-05-04
- Granted: 2008-08-05
- Earliest claimed: 2004-11-02
- Assignees: Apic Yamada Corporation
- Inventors: Fumio Miyajima; Kazuhiko Kobayashi; Kenji Nakajima; Naoya Gotoh; Kazuhiko Kobayashi; Kazuro Wada; Haruhisa Makino; Haruhisa Takahashi
- Web page: https://patentgrep.com/patent/US7407608B2

## CPC

- B29C 33/58: Applying the releasing agents
- B29C 33/68: Release sheets
- B29C 43/18: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)}
- B29C 43/58: Measuring, controlling or regulating {(for bank adjustment in calendering B29C43/245)}
- H10P 72/0468: {comprising a chamber adapted to a particular process}
- H10P 72/0478: {the substrates being processed being not semiconductor wafers, e.g. leadframes or chips}
- B29C 33/10: with incorporated venting means
- B29C 2043/561: {under vacuum conditions}
- B29C 2043/5825: {dimensions or shape, e.g. size, thickness}
- B29C 2043/5883: {ensuring cavity filling, e.g. providing overflow means}
- B29C 2043/5891: {using imaging devices, e.g. cameras}
- H10W 74/016: {using moulds}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

## Claims

### Claim 1

A resin molding equipment, comprising:
a work piece feeding section;
a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece;
a resin supplying section supplying liquid resin to the work piece;
a resin molding section having a molding die for molding the work piece with the liquid resin;
a product measuring section measuring thickness of a resin molded part of the molded product;
a product accommodating section; and a control section for controlling said sections,
wherein said work piece measuring section includes an X-Y table for moving the work piece to a sensing position;
said product measuring section includes an X-Y table for moving the molded product to the sensing position; and
said control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by said resin supplying section, on the basis of the thickness measured by said work piece measuring section and the thickness measured by said product measuring section.

### Claim 2 (depends on 1)

The resin molding equipment according to claim 1, wherein the work piece has a substrate and a plurality of semiconductor chips mounted on the substrate, said product measuring section includes a sensor unit for measuring thickness of the resin molded parts of the semiconductor chips, and the adjusting means adjusts an amount of the liquid resin, which is supplied to the work piece by said resin supplying section, on the basis of the thickness of the resin molded parts measured by the sensor unit.

### Claim 3 (depends on 2)

The resin molding equipment according to claim 2, wherein the sensor unit includes at least a pair of sensors, one of which irradiates a laser beam and the other of which receive a reflected laser beam so as to measure the thickness, are arranged in a thickness direction of the molded product and respectively provided on the both sides thereof.

### Claim 4 (depends on 1)

The resin molding equipment according to claim 1, wherein the molding die includes:
a press mechanism, which flatly presses the work piece onto a clamping face of the molding die when the work piece is set at a prescribed position in the molding die; and
a driving rod for driving the press mechanism.

### Claim 5 (depends on 4)

The resin molding equipment according to claim 4, wherein the press mechanism has a press hook, which is capable of pressing an edge of the work piece onto the clamping face and flatly holding the work piece thereon when the work piece is fed to the molding die, the press hook is capable of turning in a plane perpendicular to the clamping face, and the press mechanism further has a moving mechanism for moving the press hook between a pressing position, at which the press hook presses and holds the work piece on the clamping face, and a free position, at which the press hook does not interfere with the edge of the work piece.

### Claim 6 (depends on 1)

The resin molding equipment according to claim 1,
wherein said resin supplying section includes a dispenser, which supplies a prescribed amount of the liquid resin to the work piece, and
the dispenser comprises:
a cylinder block including a cylinder part storing the liquid resin, a fluid path connecting the cylinder part to a liquid container and a fluid path connecting the cylinder part to a discharge nozzle;
a plunger sliding in the cylinder part;
a supply valve being provided to the cylinder block, the supply valve opening and closing the fluid path between the cylinder block and the liquid container;
a discharge valve being provided to the cylinder block, the discharge valve opening and closing the fluid path between the cylinder block and the discharge nozzle; and
driving units respectively driving the plunger, the supply valve and the discharge valve
wherein base ends of the plunger, the supply valve and the discharge valve are respectively connected to connecting ends of the driving units; and
the connected parts are not disconnected in moving directions of the plunger, the supply valve and the discharge valve, but can be disconnected in directions perpendicular to the moving directions thereof.

### Claim 7 (depends on 6)

The dispenser according to claim 6, further comprising: a frame for holding the cylinder block, the frame being engaged with the cylinder block, whereby the frame is allowed to disconnect from the cylinder block in the vertical direction, but the frame is inhibited to move rearward; and means for fixing the cylinder block to the frame, the fixing means being provided to a front part of the frame and pressing the cylinder block backward.

### Claim 8 (depends on 1)

The resin molding equipment according to claim 1,
wherein the molding die comprises:
a cavity block being formed on the basis of an arrangement of a cavity, in which the work piece is molded with the resin;
a clamper enclosing the cavity block so as to form a cavity concave, whose inner bottom face is constituted by an end face of the cavity block, the clamper being capable of sliding on a side face of the cavity block in directions of opening and closing the molding die; and
an air sucking hole being formed in an inner face of the clamper, which slidably contacts the side face of the cavity block, the air sucking hole being communicated to the cavity concave so as to suck a release film into the cavity concave, the air sucking hole is formed at a prescribed position, where the sucking hole is communicated to the cavity concave when the die is opened and where the air sucking hole is closed when the cavity block is moved to a position for clamping the die.

### Claim 9 (depends on 8)

The resin molding equipment according to claim 8, wherein a resin molding area of the molding die is located in a vacuum chamber, and the vacuum chamber is communicated to a vacuum unit.

### Claim 10 (depends on 1)

The resin molding equipment according to claim 1, wherein the molding die has: a cavity for molding an element mounting area of an electronic device with the resin; and a dummy cavity being communicated to an edge of the cavity so as to trap air.

### Claim 11 (depends on 10)

The resin molding equipment according to claim 10, wherein the molding die further has an air vent communicated to the dummy cavity.

### Claim 12 (depends on 10)

The resin molding equipment according to claim 10, wherein a resin molding area of the molding die, which clamps and molds the work piece, is enclosed by a vacuum chamber, and air in the vacuum chamber is discharged by a vacuum unit.

### Claim 13 (depends on 1)

A resin molding method performed in the resin molding equipment of claim 1, wherein a work piece, in which a plurality of semiconductor chips are layered on a substrate, is compression-molded in a molding die with resin, said method comprising the steps of: storing cubic volumes of the semiconductor chips and amount of supplying the resin to each semiconductor chip; measuring a distance “Z” between the substrate and the outermost semiconductor chip; detecting a number of layering the semiconductor chips on the basis of the measured distance “Z”; calculating amount of supplementing the resin to the semiconductor chips; sending the amount of supplementing the resin to the resin supplying section as control data; and supplying the resin to the work piece from the resin supplying section on the basis of the control data.

### Claim 14 (depends on 13)

The method according to claim 13, wherein the amount of supplementing the resin corresponds to the cubic volume of the semiconductor chip which needs supplementation of the resin.

### Claim 15 (depends on 13)

The method according to claim 13, wherein the distance “Z” is measured by a measuring instrument.

### Claim 16 (depends on 13)

The method according to claim 13, wherein the distance “Z” is measured from an image photographed by an imaging device.