# US 7,407,605 B2 · Manufacturable CoWP metal cap process for copper interconnects

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- Number: US 7,407,605 B2
- Document ID: US7407605B2
- Status: Granted
- Kind: B2
- Application number: 11/751,788
- Filed: 2007-05-22
- Published: 2007-09-20
- Granted: 2008-08-05
- Earliest claimed: 2004-12-22
- Assignees: International Business Machines Corporation
- Inventors: Darryl D. Restaino; Donald F. Canaperi; Judith M. Rubino; Sean P. E. Smith; Richard O. Henry; James E. Fluegel; Mahadevaiyer Krishnan
- Web page: https://patentgrep.com/patent/US7407605B2

## CPC

- H10P 14/46: using a liquid
- C23C 18/1241: {Metallic substrates}
- C23C 18/1607: {by direct patterning}
- C23C 18/1608: {from pretreatment step, i.e. selective pre-treatment}
- C23C 18/1844: {with use of organic or inorganic compounds other than metals, first}
- C23C 18/50: with alloys based on iron, cobalt or nickel
- H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)}
- H10W 20/037: {the barrier, adhesion or liner layers being on top of a main fill metal}
- H10W 20/044: {for electroless plating}
- H05K 2203/0716: Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
- H05K 2203/072: Electroless plating, e.g. finish plating or initial plating
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An aqueous seeding solution of palladium acetate, acetic acid and chloride.

## Claims

### Claim 1

A seeding solution for depositing a palladium seed on copper comprising an aqueous solution of palladium acetate, acetic acid, and hydrochloric acid.

### Claim 2 (depends on 1)

The seeding solution of claim 1 wherein the aqueous solution of palladium acetate, acetic acid, and chloride comprises 0.01 g/l palladium acetate, 0.25 to 5 volume percent acetic acid and 3 to 10 ppm hydrochloric acid.

### Claim 3 (depends on 1)

The seeding solution of claim 1 wherein the aqueous solution of palladium acetate, acetic acid, and chloride comprises 0.01 g/l palladium acetate, 0.25 to 1 volume percent acetic acid and 3 to 10 ppm hydrochloric acid.