# US 7,407,395 B2 · Latch for connecting a component to a device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,407,395 B2 - Document ID: US7407395B2 - Status: Granted - Kind: B2 - Application number: 11/756,351 - Filed: 2007-05-31 - Published: 2007-10-04 - Granted: 2008-08-05 - Earliest claimed: 2004-09-13 - Assignees: Hewlett-Packard Development Company, L.P. - Inventors: Ronald E. Deluga; Earl Moore; Jeffrey K. Jeansonne - Web page: https://patentgrep.com/patent/US7407395B2 ## CPC - G06F 1/1632: {External expansion units, e.g. docking stations} - E05C 19/022: {Released by pushing in the closing direction} - Y10S 439/923: Separation or disconnection aid - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - E05C: BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS (latching means for sideboard or tailgate structures for vehicles B62D, {B62D33/02}; fastening devices for constructional or engineering elements E04, F16B; locks, fastening devices structurally or operatively combined or having significant cooperation with locks E05B; means for operating or controlling wing fasteners in conjunction with mechanisms for moving the wing E05F) - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract One embodiment is a system for holding a component in a device comprising: a latch feature that is connected to one of the component and the device and has a tang and a cavity; a latch module that is connected to the other of the device and the component and has a first pin that interacts with the tang and a second pin that moves between a first position and a second position, wherein the first position is within the latch module, and the second position is within the cavity; and wherein the first pin and the second pin are connected with each other such that a movement of the first pin causes the second pin to change from one of the first position and the second position to the other of the first position and the second position. ## Claims ### Claim 1 A method, comprising: moving a first pin of a device via contact with a tang of a component inserted into the device; moving a second pin of the device from a retracted position to a position that is within a cavity of the component by movement of the first pin of the device that changes the proximity of the first pin to second pin; and engaging the second pin with a side of the cavity, thereby preventing the component from moving out of the device. ### Claim 2 (depends on 1) The method of claim 1, further comprising moving the second pin into the cavity as the distance between the first pin and the second pin decreases. ### Claim 3 (depends on 1) The method of claim 1, further comprising applying force to a faceplate of the component to move the component into the device until the faceplate of the component is within a housing of the device. ### Claim 4 (depends on 1) The method of claim 1, further comprising discontinuing application of force to a faceplate of the component to allow the component to move to an operational position. ### Claim 5 (depends on 4) The method of claim 4, further comprising moving the component from a location where the faceplate is within the device housing to an operational position where the faceplate is flush with a device housing. ### Claim 6 (depends on 4) The method of claim 4, further comprising moving the component to an operational position via pressure of the first pin against the tang. ### Claim 7 (depends on 1) The method of claim 1, further comprising initiating extraction of the component from the device by applying force to the component to move the component from an operational location to a location further within the device. ### Claim 8 (depends on 7) The method of claim 7, further comprising moving the second pin from the cavity of the component to a retracted position within the device as the proximity of the first pin to the second pin changes. ### Claim 9 (depends on 7) The method of claim 7, further comprising moving the second pin from the cavity of the component to a retracted position within the device as the distance between the first pin and the second pin decreases. ### Claim 10 (depends on 7) The method of claim 7, further comprising: discontinuing the application of force to push the component into the unit; and ejecting, at least in part, the component from the device by force applied to the tang via the first pin. ### Claim 11 A method, comprising: moving a first pin of a component via contact with a tang of a device into which the component is inserted; moving a second pin of the component from a retracted position to a position that is within a cavity of the device by movement of the first pin of the component that changes the proximity of the first pin to second pin; and engaging the second pin with a side of the cavity, thereby preventing the component from moving out of the device. ### Claim 12 (depends on 11) The method of claim 11, further comprising moving the second pin into the cavity as the distance between the first pin and the second pin decreases. ### Claim 13 (depends on 11) The method of claim 11, further comprising applying force to a faceplate of the component to move the component into the device until the faceplate of the component is within a housing of the device. ### Claim 14 (depends on 13) The method of claim 13, further comprising discontinuing application of force to the faceplate of the component to allow the component to move to an operational position. ### Claim 15 (depends on 14) The method of claim 14, further comprising moving the component from a location where the faceplate is within the device housing to an operational position where the faceplate is flush with a device housing. ### Claim 16 (depends on 14) The method of claim 14, further comprising moving the component to an operational position via pressure of the tang against the first pin. ### Claim 17 (depends on 11) The method of claim 11, further comprising initiating extraction of the component from the device by applying force to the component to move the component from an operational location to a location further within the device. ### Claim 18 (depends on 17) The method of claim 17, further comprising moving the second pin from the cavity of the device to a retracted position within the component as the proximity of the first pin to the second pin changes. ### Claim 19 (depends on 17) The method of claim 17, further comprising moving the second pin from the cavity of the device to a retracted position within the component as the distance between the first pin and the second pin decreases. ### Claim 20 (depends on 17) The method of claim 17, further comprising: discontinuing the application of force to push the component into the unit; and ejecting, at least in part, the component from the device by force applied to the tang via the first pin.