# US 7,407,386 B2 · Wired circuit board and production method thereof

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- Number: US 7,407,386 B2
- Document ID: US7407386B2
- Status: Granted
- Kind: B2
- Application number: 11/705,408
- Filed: 2007-02-13
- Published: 2007-08-16
- Granted: 2008-08-05
- Earliest claimed: 2006-02-14
- Assignees: Nitto Denko Corporation
- Inventors: Kazushi Ichikawa; Yuichi Takayoshi
- Web page: https://patentgrep.com/patent/US7407386B2

## CPC

- H05K 1/0269: {for visual or optical inspection}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/3452: Solder masks
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K 2201/0989: Coating free areas, e.g. areas other than pads or lands free of solder resist
- H05K 2201/10674: Flip chip
- H05K 2203/163: Monitoring a manufacturing process
- H05K 2203/166: Alignment or registration; Control of registration
- H10W 46/101: {characterised by the type of information, e.g. logos or symbols}
- H10W 46/601: {for use after dicing}
- H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates}
- H10W 70/682: {comprising holes having chips therein}
- H10W 70/685: comprising multiple insulating layers
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.

## Claims

### Claim 1

A wired circuit board comprising:
an insulating base layer;
a conductive pattern formed on the insulating base layer; and
an insulating cover layer formed on the insulating base layer for covering the conductive pattern,
wherein the conductive pattern includes terminal portions for connecting with external terminals;
the insulating cover layer has an opening formed correspondingly for the respective terminal portions; and
a position determining zone, for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position, is provided in the proximity of the terminal portions,
wherein the position determining zone is formed to extend along a direction of the margin of the insulating cover layer, and
wherein the position determining zone is defined by a pair of determining marks which are disposed opposite to each other in a direction intersecting with the direction along the margin of the insulating cover layer and are spaced apart by an amount to allow tolerance to an area where the margin of the insulating cover layer is formed.

### Claim 2 (depends on 1)

The wired circuit board according to claim 1, wherein a plurality of terminal portions are arranged in parallel along the direction of the margin of the insulating cover layer, the conductive pattern includes wires extending from the terminal portions in the direction intersecting with the direction along the margin of the insulating cover layer correspondingly to the respective terminal portions, and
wherein the determining marks are located outside of the wires arranged at outermost sides of the direction extending along the margin of the insulating cover layer.

### Claim 3 (depends on 2)

The wired circuit board according to claim 2, wherein the determining marks are projected outward from the wires arranged at both outermost sides of the direction extending along the margin of the insulating cover layer.

### Claim 4

A production method of a wired circuit board comprising the steps of:
forming a conductive pattern including terminal portions for connecting with external terminals on an insulating base layer;
forming an insulating cover layer on the insulating base layer to cover the conductive pattern so that an insulating cover layer is formed with an opening from which the terminal portions are exposed;
forming a position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position; and
wherein in the step of determining whether or not the margin of the insulating cover layer is located in a proper position, when the margin of the insulating cover layer is within the position determining zone, the wired circuit board is determined to be non-defective, while when the margin of the insulating cover layer is out of the position determining zone, the wired circuit board is determined to be defective.

### Claim 5 (depends on 4)

The production method of the wired circuit board according to claim 4, wherein in the steps of forming the conductive pattern and forming the position determining zone, the conductive pattern and the position determining zone are formed simultaneously.