# US 7,407,272 B2 · Ink jet head substrate and ink jet head having metal carbon nitride resistor

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- Number: US 7,407,272 B2
- Document ID: US7407272B2
- Status: Granted
- Kind: B2
- Application number: 11/070,498
- Filed: 2005-03-03
- Published: 2005-11-03
- Granted: 2008-08-05
- Earliest claimed: 2004-03-11
- Assignees: Samsung Electronics Co., Ltd.
- Inventors: Jae-Sik Min; Sung-Joon Park; Young-Ung Ha
- Web page: https://patentgrep.com/patent/US7407272B2

## CPC

- B41J 2/14129: {Layer structure}
- B41J 2/1412: {Shape}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

An ink jet head substrate, an ink jet head and method of manufacturing the ink jet head substrate. The ink jet head substrate includes a supporting structure and at least one heat-generating resistor disposed on the supporting structure to generate a thermal energy to eject ink and made of metal carbon nitride. The metal carbon nitride is represented as a chemical formula of MxCyNz where M is metal, X is within about 20 through 80, Y is within about 3 through 25, and Z is within about 10 through 60, when X+Y+Z=100. Further, the heat-generating resistor has a resistivity of 300˜2000 μΩ·Cm.

## Claims

### Claim 1

An ink jet head substrate used with an ink jet head, comprising:
a supporting structure; and
at least one heat-generating resistor disposed on the supporting structure to generate thermal energy to eject ink, wherein the heat-generating resistor is made of metal carbon nitride represented as a chemical formula of MxCyNz, where M is X is within about 20 through 80, Y is within about 3 through 25, and Z is within about 10 through 60, when X+Y+Z=100.

### Claim 2 (depends on 1)

The ink jet head substrate as claimed in claim 1, wherein the metal is one selected from a group consisting of Ta, W, Cr, Mo, Ti, Zr, Hf, and a combination thereof.

### Claim 3 (depends on 1)

The ink jet head substrate as claimed in claim 1, wherein the heat-generating resistor has a resistivity of about 300˜2000 μΩ·Cm.

### Claim 4 (depends on 1)

The ink jet head substrate as claimed in claim 1, wherein the heat-generating resistor has a thickness of about 100˜2000 Å.

### Claim 5 (depends on 1)

The ink jet head substrate as claimed in claim 1, further comprising:
a thermal barrier layer interposed at least between the supporting structure and the heat-generating resistor;
wiring lines electrically connected to the heat-generating resistor to supply an electric signal to the heat-generating resistor to generate the thermal energy;
a passivation layer covering the heat-generating resistor and the wiring lines; and
an anti-cavitation layer disposed on the passivation layer to overlap at least with the heat-generating resistor.

### Claim 6

An ink jet head comprising:
an ink jet head substrate having a supporting structure and at least one heat-generating resistor disposed on the supporting structure to generate a thermal energy to eject ink, wherein the heat-generating resistor is made of metal carbon nitride represented as a chemical formula of MxCyNz, where M is metal, X is within about 20 through 80, Y is within about 3 through 25, and Z is within about 10 through 60, when X+Y+Z=100; and
a chamber structure disposed on the inkjet head substrate to define at least one ink chamber having the heat-generating resistor therein, and having at least one aperture through which the ink is ejected.

### Claim 7 (depends on 6)

The ink jet head as claimed in claim 6, wherein the metal is one selected from a group consisting of Ta, W, Cr, Mo, Ti, Zr, Hf, and a combination thereof.

### Claim 8 (depends on 6)

The ink jet head as claimed in claim 6, wherein the heat-generating resistor has a resistivity of 300˜2000 μΩ·Cm.

### Claim 9 (depends on 6)

The ink jet head as claimed in claim 6, wherein the heat-generating resistor has a thickness of about 100˜2000 Å.

### Claim 10 (depends on 6)

The ink jet head as claimed in claim 6, further comprising:
a thermal barrier layer interposed at least between the supporting structure and the heat-generating resistor;
wiring lines electrically connected to the heat-generating resistor to supply an electrical signal to the heat-generating resistor to generate the thermal energy;
a passivation layer covering the heat-generating resistor and the wiring lines; and
an anti-cavitation layer disposed on the passivation layer to overlap at least with the heat-generating resistor.

### Claim 11 (depends on 6)

The ink jet head as claimed in claim 6, wherein the chamber structure comprising:
a side wall structure defining a side wall of the ink chamber; and
a material layer disposed on the side wall structure to form one surface of the ink chamber and provided with at least one aperture through which the ink is ejected.

### Claim 12

An ink jet head comprising:
an ink jet head substrate having a supporting structure, a heat-generating resistive layer pattern formed on the supporting structure and made of a tertiary compound including a metal component, carbon, and nitrogen in accordance with a chemical formula MxCyNz, where M is the metal component, X is within about 20 through 80, Y is within about 3 through 25, and Z is within about 10 through 60, when X+Y+Z=100, a conductive layer formed on a first and a second portions of the heat-generating resistive layer pattern to form wiring lines, a passivation layer formed on the wiring lines of the conductive layer and a third portion of the heat-generating resistive layer pattern disposed between the first and second portions, and an anti-cavitation layer formed on the passivation layer; and
a chamber structure formed on the ink jet heat substrate to define an ink chamber and a nozzle to correspond to the third portion of the heat-generating resistive layer pattern.