# US 7,407,270 B2 · Liquid jet head and liquid jet apparatus

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- Number: US 7,407,270 B2
- Document ID: US7407270B2
- Status: Granted
- Kind: B2
- Application number: 10/507,592
- Filed: 2003-03-18
- Published: 2005-07-28
- Granted: 2008-08-05
- Earliest claimed: 2002-03-18
- Assignees: Seiko Epson Corporation
- Inventors: Yutaka Furuhata
- Web page: https://patentgrep.com/patent/US7407270B2

## CPC

- B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2002/14241: {having a cover around the piezoelectric thin film element}
- B41J 2002/14419: {Manifold}
- B41J 2002/14491: {Electrical connection}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

Provided are a liquid jet head and a liquid jet apparatus in which it is possible to securely connect drawn wires and connection wires and to improve reliability. Connection portions 91 of drawn wires 90 drawn from piezoelectric elements 300 and pad portions 101 of a drive IC 100 for driving the piezoelectric elements 300 are connected by connection wires 110 formed by wire bonding and extended in directions intersecting drawing directions of the connection portions 91. Accordingly, the connection wires 110 and the drawn wires 90 are suitably connected.

## Claims

### Claim 1

A liquid jet head comprising a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices are formed, and piezoelectric elements including a lower electrode, piezoelectric layers and upper electrodes provided on one side of the passage-forming substrate through a vibration plate;
wherein connection portions of drawn wires drawn from the piezoelectric elements and pad portions of a drive IC for driving the piezoelectric elements are connected by connection wires formed by wire bonding and extended in directions intersecting drawing directions of the connection portions of the drawn wires; and
wherein the connection portions are provided to be slanted along extension directions of the connection wires from main body portions of the drawn wires, and a width of the connection portions is narrower than a maximum width of bonding regions of the connection wires and equal to or wider than ⅓ of the maximum width.

### Claim 2 (depends on 1)

The liquid jet head according to claim 1, wherein a pitch of the adjacent connection portions is narrower than a maximum width of the bonding regions of the connection wires.

### Claim 3 (depends on 1)

The liquid jet head according to claim 1, wherein the pressure generating chambers are formed by performing anisotropic etching on a single crystal silicon substrate, and each layer of the piezoelectric element is formed by deposition and lithography methods.

### Claim 4

A liquid jet head comprising a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices are formed, and piezoelectric elements including a lower electrode, piezoelectric layers and upper electrodes provided on one side of the passage-forming substrate through a vibration plate,
wherein drawn wires drawn from the piezoelectric elements to the passage-forming substrate and pad portions of a drive IC for driving the piezoelectric elements are connected by connection wires formed by wire bonding, and an angle, within a plane substantially parallel to the plane of the passage-forming substrate, between extension directions of the connection wires and extension directions of connection portions, to which the connection wires are connected, of the drawn wires is in a range of 45°±15°.

### Claim 5 (depends on 4)

The liquid jet head according to claim 4, wherein a width of the drawn wires is equal to or narrower than a width of the pad portions provided in the drive IC.

### Claim 6 (depends on 4)

The liquid jet head according to claim 4, wherein a pitch of the drawn wires and a pitch of the pad portions provided in the drive IC are the same.

### Claim 7 (depends on 4)

The liquid jet head according to claim 4, wherein a sealing plate having a piezoelectric element holding portion in a region facing the piezoelectric elements is joined with a side of the passage-forming substrate where the piezoelectric elements are formed, and the drive IC is installed on the sealing plate.

### Claim 8 (depends on 4)

The liquid jet head according to claim 4, wherein the pressure generating chambers are formed by performing anisotropic etching on a single crystal silicon substrate, and each layer of the piezoelectric elements is formed by deposition and lithography methods.

### Claim 9 (depends on 1, 2, 3, 4, 7)

A liquid jet apparatus comprising a liquid jet head in any one of claims 1, 2, 4, 7, 3, and 8.