System and method for online end point detection for use in chemical mechanical planarization
AssigneeUniversity of South Florida
InventorsTapas K Das, Rajesh Ganesan, Arun K Sikder, Ashok Kumar
Life of this patent
Estimating the term…
Loading patent…
AssigneeUniversity of South Florida
InventorsTapas K Das, Rajesh Ganesan, Arun K Sikder, Ashok Kumar
Estimating the term…
The present invention is an online methodology for end point detection for use in a chemical mechanical planarization process which is both robust and inexpensive while overcoming some of the drawbacks of the existing end point detection approaches currently known in the art. The present invention provides a system and method for identifying a significant event in a chemical mechanical planarization process including the steps of decomposing coefficient of friction data acquired from a chemical mechanical planarization process using wavelet-based multiresolution analysis, and applying a sequential probability ratio test for variance on the decomposed data to identify a significant event in the chemical mechanical planarization process.
A method of identifying an end point of polishing in a chemical mechanical planarization process, the method comprising the steps of:
A computer-implemented process for identifying an endpoint of polishing in a chemical mechanical planarization process, the method comprising the steps of:
A system for identifying an endpoint of polishing in a chemical mechanical planarization process, the system comprising:
A computer readable storage medium executed by a processor for identifying an endpoint of polishing in a chemical mechanical planarization process, the computer readable storage medium comprising:
Dependencies are inferred from the claim text.