Circuit board device and method of interconnecting wiring boards

A circuit board device, comprising:

• a first wiring board having a first plurality of electrode terminals arranged in a row on a first layer, and a second plurality of electrode terminals arranged in a row on a second layer, wherein a step difference exists between the first and second layers;
• a second wiring board having a third plurality of electrode terminals arranged in a row on a third layer and a fourth plurality of electrode terminals arranged in a row on a fourth layer, wherein a step difference exists between the third and fourth layers;
• and
• an anisotropic conductive member disposed between the first wiring board and the second wiring board to connect at least one of the electrode terminals of the first wiring board at least one of the electrode terminals of the second wiring board,
• wherein the anisotropic conductive member has step differences corresponding to the step differences in the first and second wiring boards, and
• wherein the first wiring board, the second wiring board, and the anisotropic conductive member disposed therebetween constitute a laminate pressed and held in a lamination direction.