Backplane with power plane having a digital ground structure in signal regions

A method of fabricating high-speed signal paths in an electrical backplane, the method comprising:

• embedding multiple power planes in the backplane, the multiple power planes having the capability to power components connected to the backplane through at least one power connector region;
• routing a group of high-speed signals through the multiple power planes in a high-speed connector region comprising a plurality of conductive high-speed signaling throughholes and at least one conductive digital ground throughhole;
• for each power plane, forming a clearance between a first conductive plane section in the high-speed connector region and a power supply section of the power plane;
• for each first conductive plane section, forming a clearance between the first conductive plane section and each of the high-speed signaling throughholes in the high-speed connector region;
• and
• for each first conductive plane section, connecting the conductive plane section to at least one of the digital ground throughholes.