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AssigneeMitsubishi Electric Corporation
InventorTsuyoshi Miura
Estimating the term…
A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has solder drawing lands, in a neighboring area, between the front soldering land groups and the rear soldering land groups adjacent to the front soldering land groups, and/or a trailing area of the rear soldering land groups. The solder drawing lands are formed with slits substantially parallel to the lines of soldering lands of the front soldering land groups or the rear soldering land groups placed in front of the solder drawing lands. These result in an advantageous effect of enabling the prevention of the occurrence of soldering bridges and soldering residues in the front soldering land groups or the rear soldering land groups.
A four-way lead flat package IC-mount printed circuit board comprising a printed circuit board on which a four-way lead flat package IC is to be mounted and which has front soldering land groups and rear soldering land groups for soldering the four-way lead flat package IC, the printed circuit board including solder drawing lands formed in a neighboring area between the front soldering land groups and the rear soldering land groups adjacent to the front soldering land groups, and/or a trailing area of the rear soldering land groups, wherein each of the solder drawing lands has a slit formed substantially parallel to lines of adjacent soldering lands of the front soldering land groups or the rear soldering land groups located in front of the solder drawing land, a forward portion and a backward portion respectively formed on the forward side and the backward side of the slit and joint portions formed on both sides of the slit for connecting the forward portion and the backward portion.
A method of soldering a four-way lead flat package IC on a printed circuit board on which the four-way lead flat package IC is to be mounted and which has front soldering land groups and rear soldering land groups for soldering the four-way lead flat package IC, the method comprising:
Dependencies are inferred from the claim text.