Cooling device, substrate, and electronic equipment
AssigneeFujitsu Limited
InventorsSonomasa Kobayashi, Kaigo Tanaka, Masaki Iwata
Life of this patent
Estimating the term…
Abstract
A cooling device for cooling electronic components mounted on a substrate, comprising a radiating member having a pair of mounting plates formed of a conductive sheet metal member in generally channel shape in cross section and positioned parallel with each other and a connection plate for connecting the pair of mounting plates to each other and a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other of the mounting plates of the radiating member is formed so as to be mountable on the substrate in an abutting state thereof on the electronic components mounted on the substrate.
Claims20
A cooling device for cooling electronic components mounted on top and bottom surfaces of a substrate, comprising:
- a radiating member having a generally U-shaped cross section and including a pair of mounting plates formed of a heat conductive sheet metal member which are positioned in parallel with each other and a connection plate for connecting the pair of mounting plates to each other;
- and
- a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other one of the mounting plates of the radiating member is in a pressure contact with one of the electronic components mounted on the substrate, in which state the cooling part is attached to the substrate, and wherein the pair of mounting plates of the radiating member are so disposed as to sandwich the electronic components mounted on the top and bottom surfaces of the substrate.
A substrate having electronic components mounted on a top and a bottom surface thereof, comprising:
- a radiating member having a generally U-shaped cross section and including a pair of mounting plates formed of a heat conductive sheet metal member which are positioned in parallel with each other and a connection plate for connecting the pair of mounting plates to each other;
- and
- a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other one of the pair of mounting plates of the radiating member is in a pressure contact with one of the electronic components,
- the connection plate is situated outside the region of the substrate,
- the cooling fan mounted on the one of the mounting plates is disposed on a side of the substrate opposite that of the one of the electronic components, and
- the pair of mounting plates of the radiating member are so disposed as to sandwich the electronic components mounted on the top and bottom surfaces of the substrate.
An electronic equipment including a substrate having electronic components mounted on a top and a bottom surface thereof, comprising:
- a radiating member having a substantially U-shaped cross section and including a pair of mounting plates formed of a heat conductive sheet metal member which are positioned in parallel with each other and a connection plate for connecting the pair of mounting plates to each other;
- and
- a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other one of the pair of mounting plates of the radiating member is in a pressure contact with one of the electronic components,
- the pair of mounting plates of the radiating member are so disposed as to sandwich the electronic components mounted on the top and bottom surfaces of the substrate,
- the connection plate is situated outside the region of the substrate, and
- the cooling fan mounted on the one of the mounting plates is disposed on a side of the substrate opposite that of the one of the electronic components.
Dependencies are inferred from the claim text.