Illumination system particularly for microlithography
AssigneeCarl Zeiss SMT GmbH
InventorsJoachim Hainz, Wolfgang Singer, Erich Schubert
Life of this patent
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Abstract
An illumination system for scannertype microlithography along a scanning direction with a light source emitting a wavelength especially ≦193 nm. The illumination system includes a plurality of raster elements. The plurality of raster elements is imaged into an image plane of the illumination system to produce a plurality of images being partially superimposed on a field in the image plane. The field defines a non-rectangular intensity profile in the scanning direction.
Claims23
An illumination system having a light source emitting light having a wavelength, comprising:
- a first optical component with a plurality of field mirror raster elements receiving said light from said light source;
- and
- a second optical component with a plurality of pupil mirror raster elements receiving said light from said field mirror raster elements, said plurality of pupil mirror raster elements having at least a first pupil raster element including a first shape and a second pupil mirror raster element having a second shape, said first shape being substantially different from said second shape.
A projection exposure apparatus for microlithography, comprising:
- a first optical component with a plurality of field mirror raster elements receiving light from a light source;
- a second optical component with a plurality of pupil mirror raster elements receiving light from said field mirror raster elements, said plurality of pupil mirror raster elements including at least a first pupil raster element having a first shape and a second pupil mirror raster element having a second shape, wherein said first shape is substantially different from said second shape;
- a first object being located at an object plane;
- a light-sensitive object on a support system;
- and
- a projection objective to image said first object onto said light-sensitive object.
A method for a production of microelectronic components with a projection exposure system, comprising the steps of:
- receiving light with a first optical component with a plurality of field mirror raster elements from a light source;
- receiving light from said field mirror raster elements with a second optical component with a plurality of pupil mirror raster elements, said plurality of pupil mirror raster elements including at least a first pupil raster element having a first shape and a second pupil mirror raster element having a second shape, wherein said first shape is substantially different from said second shape;
- providing a first object being located at an object plane;
- providing a light-sensitive object on a support system;
- and
- imaging said first object onto said light-sensitive object with a projection objective.
Dependencies are inferred from the claim text.