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US 7,405,484 B2Granted
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
AssigneeSanyo Electric Co., Ltd.
InventorsRyosuke Usui, Hideki Mizuhara, Takeshi Nakamura
Life of this patent
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Abstract
An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.
Claims13
A semiconductor device comprising:
- a base material;
- a conductor circuit in the base material;
- a dielectric film covering at least part of the base material;
- a pad electrode on a surface of the base material or a surface of the dielectric film and connected with the conductor circuit;
- a semiconductor chip on the dielectric film;
- a conductive member electrically connecting the pad electrode and the semiconductor chip,
- wherein the pad electrode comprises an electrode film and a conductive protective film on a surface of the electrode film,
- wherein one end of the conductive member contacts the conductive protective film and
- wherein the surface of the dielectric film is a plasma treated surface, and the surface of the conductive protective film comprises a plasma-resistant material.
6 more elements
A semiconductor device comprising:
- a base material;
- a conductor circuit provided in the base material;
- a dielectric film covering at least a part of the base material;
- a pad electrode provided on a surface of the base material or a surface of the dielectric film and connected with the conductor circuit;
- a semiconductor chip formed on the dielectric film;
- and
- a conductive member electrically connecting the pad electrode and the semiconductor chip, wherein the pad electrode comprises an electrode film and a conductive protective film formed on a surface of the electrode film, the conductive member is formed so that one end thereof contacts with the conductive protective film, and a cluster of micro projections is formed on the surface of the dielectric film.
4 more elements
A semiconductor device comprising:
- a base material;
- a conductor circuit provided in the base material;
- a dielectric film covering at least a part of the base material;
- a pad electrode provided on a surface of the base material or a surface of the dielectric film and connected with the conductor circuit;
- a semiconductor chip formed on the dielectric film;
- and
- a conductive member electrically connecting the pad electrode and the semiconductor chip, wherein the pad electrode comprises an electrode film and a conductive protective film formed on a surface of the electrode film, the conductive member is formed so that one end thereof contacts with the conductive protective film, and the conductive protective film comprises an adhesive film formed on the electrode film, and a coating film formed on the adhesive film, which constitutes the surface of the conductive protective film.
4 more elements
Dependencies are inferred from the claim text.