Electronic assembly and circuit board

An electronic assembly, comprising:

• an electronic package, comprising a lead frame, having a chip pad and a plurality of inner leads, wherein the chip pad is used for carrying a chip, and the chip pad and at least a portion of the inner leads are electrically connected to a plurality of bonding pads on the chip;
• and
• a circuit board, wherein the electronic package is disposed on the circuit board and the circuit board comprises:
• an insulating layer;
• a patterned conductive layer, disposed on the insulating layer, comprising:
• a first pad, wherein the chip pad is disposed on the first pad and electrically connected to the first pad;
• an extension portion, electrically connected to the first pad;
• and
• at least one second pad, electrically connected to a first end of one of the first inner leads;
• wherein the extension portion extends to the position under a second end of the inner lead electrically connected to the second pad.

A circuit board assembled with an electronic package, wherein the electronic package comprises a first inner lead and a second inner lead and the first inner lead comprises a first end and a second end, comprising:

• an insulating layer;
• a first pad, disposed on the insulating layer;
• a second pad, disposed on the insulating layer, wherein the first end of the first inner lead is electrically connected to the second pad;
• an extension portion, disposed on the insulating layer and electrically connected to the first pad, wherein the extension portion extends to the position under the second end of the first inner lead;
• a conductive via, passing through the insulating layer and electrically connected to the extension portion, wherein the conductive via is disposed under the second end of the first inner lead;
• and
• a ground layer, disposed on the insulating layer, wherein the conductive via is electrically connected to the ground layer;
• wherein the first pad is a ground pad and the second pad is a signal pad.