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US 7,405,476 B2Granted
Asymmetric alignment of substrate interconnect to semiconductor die
AssigneeLSI Logic Corporation
InventorGary S. Delp
Life of this patent
Estimating the term…
Abstract
An apparatus includes a first semiconductor die and at least one further semiconductor die. A substrate is attached to the first die and the further die and has an electrical interconnect pattern that interconnects contacts on the first die with respective contacts on the further die. Features of the interconnect pattern have positions on the substrate with smaller tolerances relative to positions of the contacts on the first die than to positions of the contacts on the further die.
Claims15
An apparatus composing:
- a first semiconductor die;
- at least one further semiconductor die;
- and
- a substrate attached to the first die and the further die and having an electrical interconnect pattern that interconnects contacts on the first die with respective contacts on the further die, wherein features of the interconnect pattern have a smaller placement error relative to the first die than to the further die such that the feature positions of the interconnect pattern have smaller placement error relative to positions of the contacts on the first die than to positions of the contacts on the further die.
1 more element
An apparatus composing:
- a first semiconductor die comprising electrical contacts having a first diameter along a direction of die placement variation;
- at least one further semiconductor die comprising electrical contacts having a second, larger diameter along the direction of die placement variation;
- and
- a substrate attached to the first die and the further die, at least one of the die having placement variation on the substrate, wherein the substrate has an electrical interconnect pattern between the contacts on the first die and the further die with feature positions along the direction of die placement variation that have a smaller placement error relative to the first die than to the further die such that the die placement variation of the first die is smaller than the die placement variation of the second die.
1 more element
Dependencies are inferred from the claim text.