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US 7,405,474 B1Granted
Low cost thermally enhanced semiconductor package
AssigneeCypress Semiconductor Corporation
InventorBrenor L. Brophy
Life of this patent
Estimating the term…
Abstract
In one embodiment, a device is packaged using a low-cost thermally enhanced ball grid array (LCTE-BGA) package. The device may include a die with its backside mounted to the bottom side of a multi-layer packaging substrate. Thermal vias may be formed through the substrate to allow heat to be conducted away from the backside of the die to a top most metal layer of the substrate. Thermal balls may be attached to the bottom side of the substrate on the same plane as the die.
Claims14
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- wire bonds electrically coupling electrical nodes on a front side of the die to a second metal layer;
- wherein the backside of the die is attached to the second metal layer of the substrate, the second metal layer being a bottom metal layer of the substrate.
3 more elements
A device comprising:
- a packaging substrate having a plurality of metal layers;
- a die with an integrated circuit, the die having a backside attached to a bottom metal layer in the plurality of metal layers;
- a plurality of solder balls attached to the bottom metal layer and on a same plane as the die;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to thermally couple the backside of the die to a top metal layer in the plurality of metal layers;
- and
- a protective cover over the die.
3 more elements
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- and
- a thermally conductive material coupled to the first metal layer;
- wherein the die is substantially on a same plane as the solder balls.
4 more elements
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- an external heat sink attached to the first metal layer;
- wherein the die is substantially on a same plane as the solder balls.
3 more elements
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- wherein the backside of the die is attached to a second metal layer of the substrate, the second metal layer being a bottom metal layer of the substrate;
- wherein the die is substantially on a same plane as the solder balls.
3 more elements
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- a protective mold cap formed over the die;
- wherein the backside of the die is attached to a second metal layer of the substrate, the second metal layer being a bottom metal layer of the substrate.
3 more elements
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- a thermally conductive material coupled to the first metal layer;
- and
- a protective mold cap formed over the die.
4 more elements
A device comprising:
- a multi-layer packaging substrate;
- a die with an integrated circuit, a backside of the die being attached to a bottom side of the substrate;
- a plurality of solder balls attached to the bottom side of the substrate;
- a plurality of thermal vias formed through the substrate, the thermal vias being configured to conduct heat away from the backside of the die to a first metal layer of the substrate, the first metal layer being a top most metal layer of the substrate;
- an external heat sink attached to the first metal layer;
- and
- a protective mold cap formed over the die.
4 more elements
Dependencies are inferred from the claim text.