Semiconductor device and method of manufacturing the same

A semiconductor device that has a semiconductor chip, a conductive cap connected to the semiconductor chip, and a sealing resin body for sealing the semiconductor chip, and can be mounted on a mounting board, wherein

• the conductive cap comprises an upper part, a side part, and a leg,
• the semiconductor chip is disposed in a region enclosed by the upper part and the side part of the conductive cap,
• the semiconductor chip has an upper electrode on a top and first and second lower-electrodes on a bottom respectively,
• the upper electrode of the semiconductor chip is bonded to the upper part of the conductive cap via a conductive, connection material for cap connection,
• the first lower electrode of the semiconductor chip is bonded to a first external connection terminal via a conductive, first connection material,
• the second lower electrode of the semiconductor chip is bonded to a second external connection terminal via a conductive, second connection material,
• the sealing resin body covers the semiconductor chip, and is filled into the conductive cap such that the first and second, external connection terminals are exposed, and
• the leg of the conductive cap, and the first and second, external connection terminals can be electrically connected to electrodes on the mounting board respectively.