Plastic package and method of fabricating the same

A plastic package comprising:

• a plurality of terminal members each having an outer terminal having an upper surface, a lower surface and an outer side surface, an inner terminal having a contact surface, and a connecting part connecting the outer and the inner terminal;
• a semiconductor device provided with terminal pads connected to the contact surfaces of the inner terminals with bond wires;
• and
• a resin molding sealing the terminal members, the semiconductor device and the bond wires therein;
• wherein the inner terminals of the terminal members are thinner than the outer terminals and have the contact surfaces,
• the contact surfaces of the inner terminals are included in one plane, the upper surfaces of the outer terminals are included in another plane, the lower surfaces of the outer terminals of the terminal members are included in a third plane, respectively, and
• the upper, the lower and the outer side surfaces of the outer terminals of the terminal members and a surface of the semiconductor device opposite the surface provided with the terminal pads are exposed outside, and the inner terminals, the bond wires, the semiconductor device and the resin molding are included in the thickness of the outer terminals, and
• wherein the inner terminal is located closer to the semiconductor device than the outer terminal, and the inner terminal has a half-etched upper surface lower than the upper surface of the outer terminal so that the thickness of the inner terminal is thinner than that of the outer terminal, and
• wherein each inner terminal is bent toward the corresponding terminal pad in a plan view, and the inner terminals on both the end sides have a tapered shape in the plan view, and
• wherein the semiconductor device has a thickness thinner than that of the inner terminals, and each inner terminal is so constructed that the section of the inner terminal is tapered toward the inside to leave a tip on the half-etched upper surface.