Power module package structure
AssigneeCyntec Co., Ltd.
InventorsChun-Tiao Liu, Da-Jung Chen, Chun-Liang Lin, Jeng-Jen Li, Cheng Chieh Hsu, Chau Chun Wen
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Abstract
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.
Claims25
A package structure of a power module, said package structure comprising:
- a lead frame having a first surface, a second surface opposite to said first surface, and a plurality of leads;
- a circuit plate having a topside and a backside, said topside of said circuit plate being connected with part of said second surface of said lead frame to form a stacking structure;
- a substrate having a topside and a backside, said topside surface of said substrate being connected with part of said second surface of said lead frame to form another stacking structure;
- at least one first element disposed on said first surface of said lead frame or said topside of said substrate;
- at least one second element disposed on said topside of said circuit plate;
- and
- a plurality of wire bonds connecting said circuit plate with said lead frame, said circuit plate with said first element, and said first element with said lead frame.
A package structure of a power module, said package structure comprising:
- a lead frame having a first surface, a second surface opposite to said first surface, and a plurality of leads;
- a circuit plate having a topside and a backside, said topside of said circuit plate being connected with part of said lead frame to form a stacking structure;
- a substrate having a topside and a backside, and part of said lead frame being disposed on said topside of said substrate with said second surface to form another stacking structure;
- at least one first element disposed on said substrate or said lead frame disposed on said substrate;
- at least one second element disposed on said topside of said circuit plate;
- and
- a plurality of wire bonds connecting said circuit plate with said lead frame, said circuit plate with said first element, and said first element with said lead frame.
Dependencies are inferred from the claim text.