Optical sensor chip package
AssigneeSigurd Microelectronics Corp.
InventorsPo-Hung Chen, Chin-Cheng Lo, Mao-Jung Chen
Life of this patent
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Abstract
The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.
Claims20
An optical sensor chip package comprising:
- a forming frame that is a cavity has a open windows to achieve light pass and has a plurality of pads;
- a optical sensor chip which sets in the cavity inside makes use of flip chip method;
- a protection layer which sets in the bottom of the optical sensor chip has a gap with a optical sensor chip;
- a plurality of metallic traces which have a electric connection with pads of optical sensor chip extends from the forming frame surface;
- and
- a light transparent layer which sets on an open window of the forming frame.
Dependencies are inferred from the claim text.