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US 7,405,433 B2Granted
Semiconductor light emitting device
AssigneeAvago Technologies ECBU IP Pte Ltd
InventorTong F. Chew
Life of this patent
Estimating the term…
Abstract
A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.
Claims18
A light-emitting diode (“LED”) lamp comprising:
- a substrate comprising at least a first portion;
- an LED chip comprising at least a first terminal, the first terminal being attached to the first portion of the substrate;
- a first lead electrically coupled to the first terminal of the LED chip;
- a receptacle comprising a closed end and an open end, the open end comprising an aperture therein, the LED chip and the first portion of the substrate being inserted into the receptacle through the aperture;
- elastomeric encapsulant within the receptacle, the elastomeric encapsulant completely surrounding at least the LED chip and the first portion of the substrate;
- and
- rigid encapsulant disposed within the aperture of the receptacle on the elastomeric encapsulant, the elastomeric encapsulant being positioned between the closed end of the receptacle and the rigid encapsulant.
4 more elements
Dependencies are inferred from the claim text.