Interposer and electronic device fabrication method

An interposer comprising a base formed of a plurality of resin layers;

• a thin-film capacitor buried in the base, including a lower electrode, a capacitor dielectric film formed on the lower electrode, and an upper electrode formed on the capacitor dielectric film;
• a first through-electrode formed through the base and electrically connected to the upper electrode of the thin-film capacitor;
• and a second through-electrode formed through the base and electrically connected to the lower electrode of the thin-film capacitor,
• the interposer comprising:
• a plurality of said thin-film capacitors formed over a first resin layer of said plurality of resin layers, and,
• a plurality of said first through-electrodes formed through the base,
• the interposer further comprising:
• an interconnection formed over a second resin layer of said plurality of resin layers, the second resin layer being formed over said plurality of said thin-film capacitors,
• said plurality of said first through-electrodes and the upper electrodes of said plurality of said thin-film capacitors are electrically connected each other by the interconnection.