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US 7,405,364 B2Granted
Decoupled signal-power substrate architecture
AssigneeIntel Corporation
InventorsRajendran Nair, John Tang
Life of this patent
Estimating the term…
Abstract
A device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such that the integrated circuit is electrically coupled to the substrate core through the routing layer.
Claims18
A device, comprising:
- a core substrate having a first and second surface with power paths penetrating the core from the first surface to the second surface, the core substrate not including signal paths;
- a flexible tape arranged on the first surface of the core substrate, the flexible tape having no more than two layers including a routing layer on a top surface of the flex tape to route signals in a signal path and vias to allow power connections to be made to the power paths through the core substrate, the signal path perpendicular to the power paths;
- contacts on a surface of the flexible tape to allow mounting of an integrated circuit, wherein the contacts comprise power contacts and signal contacts;
- and
- package connectors on the second surface of the core substrate to allow the device to be mounted on a printed circuit substrate.
2 more elements
A method, comprising:
- providing a core substrate having first and second surfaces, wherein the core substrate has power paths penetrating the substrate from a first substrate to a second substrate;
- forming first set of contacts on the substrate on the first surface;
- forming a second set of contacts on the substrate on the second surface;
- connecting a flexible tape to the first set of contacts to provide a routing layer, the flexible tape having no more than two layers, including a top layer as the routing layer to route signals in a signal path only perpendicular to the power paths;
- connecting package connectors to the second set of contacts to connect the package connectors to the power paths;
- connecting an integrated circuit die to the flexible tape;
- and
- connecting the package connectors to a printed circuit board.
5 more elements
Dependencies are inferred from the claim text.