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US 7,405,247 B2Granted
Conductive adhesive composition
AssigneeInternational Business Machines Corporation
InventorsKrishna G. Sachdev, Daniel George Berger, Kelly May Chioujones, Glenn Graham Daves, Hilton T. Toy
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Abstract
A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.
Claims1
A reworkable conductive adhesive composition comprising:
- an epoxy based conductive adhesive containing conductive filler particles dispersed in a solvent-free hybrid epoxy polymer matrix to form a screenable conductive adhesive paste;
- wherein:
- said solvent-free hybrid epoxy polymer matrix comprises:
- a liquid epoxy precursor having a siloxane linkage and carrying an acyclic or alicyclic chain segment;
- a solid or liquid anhydride or an amine curing additive;
- an epoxy curing catalyst;
- and a polymer additive completely miscible in said epoxy precursor;
- wherein:
- said liquid epoxy precursor is a soluble mixture of 1,3-bis(glycidoxypropyl) tetramethyl disiloxane;
- said anhydride curing additive is HHPA, or a mixture of HHPA and MeHHPA;
- said epoxy curing catalyst is a combination of nonylphenol, ethylene glycol, and 2,4,6-tris(dimethylamino-methyl)phenol as a tertiary amine;
- said conductive filler particles are Au-coated Ag, Pd-coated Ag filler, Ag flake, or a combination thereof;
- and
- said polymer additive is oligomeric ABA-glycidyl methacrylate diester.
11 more elements
Dependencies are inferred from the claim text.