Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface

A method of manufacturing a semiconductor device, comprising:

• carrying out a laser beam application, with regard to a semiconductor element in which a laminated film composed of a plurality of layers including a low dielectric insulating film is formed on a surface of a semiconductor substrate, to remove a portion of the laminated film from the surface of the semiconductor substrate and a portion of the semiconductor substrate under the portion of the laminated film to a predetermined depth;
• mounting the semiconductor element on a mounting substrate;
• and
• sealing at least a surface side of the semiconductor element with resin.

A method of manufacturing a semiconductor device, comprising:

• removing a portion of a laminated film of a semiconductor element composed of a plurality of layers including a low dielectric insulating film formed on a surface of a semiconductor substrate from the surface of the semiconductor substrate and a portion of the semiconductor substrate under the portion of the laminated film to a predetermined depth;
• mounting the semiconductor element on a mounting substrate;
• and
• sealing at least a surface side of the semiconductor element with resin.