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US 7,405,157 B1Granted
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
AssigneeNovellus Systems, Inc.
InventorsJon Reid, Seyang Park
Life of this patent
Estimating the term…
Abstract
Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.
Claims15
A method for depositing copper overlying a work piece, the method comprising the steps of:
- depositing overlying the work piece a barrier layer having a surface;
- annealing said surface of said barrier layer in an oxygen-free environment to form an annealed thin film;
- after the step of annealing, exposing said surface of said barrier layer to a halide acid solution adapted to facilitate deposition of copper on said barrier layer;
- and
- electrochemically depositing copper overlying said barrier layer.
2 more elements
A method for electrochemically depositing a copper layer onto a ruthenium layer of a work piece, the method comprising the steps of:
- depositing on the work piece a ruthenium layer having a surface;
- annealing said surface of said ruthenium layer in an oxygen-free environment to form an annealed ruthenium-containing thin film;
- after the step of annealing, exposing said surface of said ruthenium layer to a halide acid solution adapted to facilitate deposition of copper on said ruthenium layer;
- and
- electrochemically depositing a layer of copper overlying said ruthenium layer.
2 more elements
Dependencies are inferred from the claim text.