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US 7,405,156 B2Granted
Method of forming wiring pattern
AssigneeNEC LCD Technologies, Ltd.
InventorHiroaki Tanaka
Life of this patent
Estimating the term…
Abstract
A photoresist pattern is formed on an insulating substrate so that it has a reverse tapered cross section and a reverse pattern of a wiring pattern to be formed. Next, a nanoparticles-containing ink is injected on a wiring region using an inkjet system, followed by a leveling process, a drying process, a resist separation process and a baking process. Thus a wiring pattern is formed.
Claims20
A method of forming a wiring pattern on an insulating substrate using a nanoparticles-containing ink, comprising:
- partitioning the insulating substrate into wiring regions using a photoresist film;
- and
- drawing the wiring pattern on the insulating substrate by injecting the ink thereon, the ink comprising metallic nanoparticles,
- wherein patterns of the photoresist film which partition the insulating substrate into the wiring regions comprise a reverse tapered cross section, and
- wherein said drawing of said wiring pattern comprises leveling the ink formed on the wiring regions.
2 more elements
A method of forming a wiring on an insulating substrate, comprising:
- partitioning a surface of the insulating substrate into wiring regions using a photoresist film forming a reverse tapered cross section;
- injecting an ink comprising nanoparticles on the wiring region using an ink-jet process;
- leveling the ink formed on the wiring region;
- drying the ink which has been leveled;
- separating the photoresist film from the substrate;
- and
- baking the ink on the wiring region.
4 more elements
Dependencies are inferred from the claim text.