Circuit package and method of plating the same

A method of selective plating on a circuit substrate comprising:

• applying a first metal pattern to a surface of the substrate;
• applying a second metal pattern to the surface of the substrate, the second metal pattern being electrically isolated from the first metal pattern;
• creating a potential voltage difference between the first metal pattern and a metal source comprising a metal of a first type and between the first metal pattern and the second metal pattern, wherein the voltage potential of the first metal pattern is less than the voltage potential of the metal source and less than the voltage potential of the second metal pattern;
• and
• selectively plating the first metal pattern with the metal of a first type, the selectively plating the first metal pattern comprising attracting the metal of a first type to the voltage potential of the first metal pattern.