Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

A method of preventing the formation and propagation of backside surface micro cracks in a semiconductor chip or wafer towards a front surface thereof, at which said chip or wafer is adapted for operative connection with components to form electronic package arrangement;

• said method comprising:
• ascertaining the presence of at least one scratch in the backside surface of said chip or wafer;
• determining that a micro crack has propagated from said at least one scratch into said semiconductor chip or wafer towards the front surface thereof;
• and
• imparting a wet etch to the backside surface and micro crack so as to blunt the leading end of said micro crack and inhibit the further forward propagation thereof.