Method of fabricating the routing of electrical signals
AssigneeAvago Technologies General IP Pte Ltd
InventorWilliam S Burton
Life of this patent
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Abstract
A method for manufacturing a layered structure for routing electrical signals comprising the steps of providing a layout for the layered structure having an insulating layer with at least one signal trace, a via, and a stub trace on a first side of the insulating layer, and a generally planar electrically conductive layer disposed on a second side of the insulating layer. Identify the stub trace and define a beneficial portion on the second side based upon a layout of the stub trace where the electrically conductive layer on the second side is to be absent. Modify the layout according to the step of defining and manufacture the layered structure according to the modified layout.
Claims7
A method for manufacturing a layered structure for routing electrical signals comprising the steps of:
- providing a layout for the layered structure having an insulating layer with at least one signal trace, a via, and a stub trace on a first side of said insulating layer, and a generally planar electrically conductive layer disposed on a second side of said insulating layer,
- identifying said stub trace,
- defining a beneficial portion on said second side based upon a layout of said stub trace where said electrically conductive layer on said second side is to be absent,
- modifying said layout according to said step of defining, and
- manufacturing said layered structure according to said modified layout.
Dependencies are inferred from the claim text.