Semiconductor device, method and apparatus for fabricating the same
AssigneeDenso Corporation
InventorsShusaku Nakazawa, Tsutomu Onoue, Hiroaki Mizuno, Hidehisa Nasu
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Abstract
A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the radiator plate and at least a part of the side surface adjoining the outer main surface are exposed from the molded resin.
Claims6
A method of fabricating a semiconductor device, wherein a work including at least one semiconductor element and at least one radiator plate which is thermally connected to the semiconductor element is arranged in a die so as to be covered and sealed with a molded resin, comprising the steps of:
- arranging a heat-resistant and flexible sheet larger than an outer main surface of the radiator plate on a part of the die facing the main surface;
- forming a bulge in the sheet by pressing the sheet against the main surface, the bulge covering at least a part of a side surface of the radiator plate adjoining the main surface of the radiator plate;
- and
- injecting the resin into the die.
Dependencies are inferred from the claim text.