Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

A method of producing a resin-encapsulated semiconductor device, using a lead frame that includes a frame and a plurality of inner leads that extend inward from the frame, the inner lead having a protruded portion provided on a surface of an outer portion of the inner lead, and the protruded portion protruding in a thickness direction and being provided with a step portion formed on each of inner and outer side portions of the protruded portion, the method comprising:

• stacking a second semiconductor chip having a smaller size than that of a first semiconductor chip, on a surface of the first semiconductor chip, and electrically connecting a first group of electrodes of the first semiconductor chip with a group of electrodes of the second semiconductor chip through second electroconductive bumps;
• after that, electrically connecting a second group of electrodes of the first semiconductor chip with the inner leads through first electroconductive bumps;
• and
• encapsulating a region including surfaces of the first and second semiconductor chips and the first and second electroconductive bumps with an encapsulating resin with surfaces of the protruded portions being exposed from the encapsulating resin.

A method of producing a resin-encapsulated semiconductor device, using a lead frame that includes a frame and a plurality of inner leads that extend inward from the frame, the inner lead having a protruded portion provided on a surface of an outer portion of the inner lead, and the protruded portion protruding in a thickness direction and being provided with a step portion formed on each of inner and outer side portions of the protruded portion, the method comprising:

• electrically connecting a second group of electrodes of a first semiconductor chip with the inner leads through first electroconductive bumps;
• after that, stacking a second semiconductor chip having a smaller size than that of the first semiconductor chip, on a surface of the first semiconductor chip, and electrically connecting a first group of electrodes of the first semiconductor chip with a group of electrodes of the second semiconductor chip through second electroconductive bumps;
• and
• encapsulating a region including surfaces of the first and second semiconductor chips and the first and second electroconductive bumps with an encapsulating resin with surfaces of the protruded portions being exposed from the encapsulating resin.

A method of producing a resin-encapsulated semiconductor device, using a lead frame that includes a frame and a plurality of inner leads that extend inward from the frame, the inner lead having a protruded portion provided on a surface of an outer portion of the inner lead, and the protruded portion protruding in a thickness direction and being provided with a step portion formed on each of inner and outer side portions of the protruded portion, the method comprising:

• stacking a second semiconductor chip having a smaller size than that of a first semiconductor chip, on a surface of the first semiconductor chip, and electrically connecting a first group of electrodes of the first semiconductor chip with a group of electrodes of the second semiconductor chip through second electroconductive bumps;
• electrically connecting a second group of electrodes of the first semiconductor chip with the inner leads through first electroconductive bumps;
• and
• encapsulating a region including surfaces of the first and second semiconductor chips and the first and second electroconductive bumps with an encapsulating resin with surfaces of the protruded portions being exposed from the encapsulating resin.