Methods and apparatus for thermal management in a multi-layer embedded chip structure

A method for improving heat transfer in an electronic assembly, the method including:

• providing a heat-generating module;
• providing a multi-layer embedded chip structure having a top surface and a bottom surface, wherein a predetermined area on the top surface is configured to connect to the heat-generating module, and the bottom surface is configured to connect to a substrate;
• the multi-layer embedded chip structure comprising a heat spreader and a semiconductor device, wherein the heat spreader is substantially coincident with the predetermined location and has a plurality of thermal vias thermally coupled to the heat spreader and extending to the top and bottom surfaces of the multi-layer embedded chip structure;
• connecting the heat-generating module to the predetermined location on the top surface of the multi-layer embedded chip structure;
• and
• connecting the bottom surface of the multi-layer embedded chip structure to a substrate.