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US 7,405,100 B1Granted
Packaging of a semiconductor device with a non-opaque cover
AssigneeNational Semiconductor Corporation
InventorsShahram Mostafazadeh, Joseph O. Smith
Life of this patent
Estimating the term…
Abstract
Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in the imaging portion of the die, the die can be electrically connected to a substrate and then encapsulated. Since the imaging portion is sealed, the encapsulant cannot get underneath the glass. By ensuring the encapsulant is not filled beyond the glass, encapsulant cannot get over the glass either.
Claims13
A method for packaging semiconductor devices comprising:
- providing a wafer having plurality of dice, each die having an imaging portion and a plurality of bonding pads;
- attaching an optical cover sheet having a substantially uniform thickness to the wafer;
- removing portions of the optical cover sheet that overlie the bonding pads to expose the bonding pads on the dice, while leaving portions of the optical cover sheet that overlie the imaging portions of the dice, thereby defining a multiplicity of isolated optical covers;
- dicing the wafer to provide a multiplicity of singulated dice, each singulated die having an associated optical cover;
- mounting a plurality of the singulated dice on a substrate;
- electrically connecting each of the mounted dice to a portion of the substrate;
- encapsulating the dice, wherein the encapsulant surrounds peripheral edges of the optical cover, but the portion of the optical covers that overlie the imaging portion of their associated die remain unobstructed;
- and
- singulating the substrate to provide a plurality of singulated semiconductor packages, wherein the removing portions of the optical cover sheet that overlie the bonding pads to expose the bonding pads on the dice is accomplished by sawing.
6 more elements
A method for packaging semiconductor devices comprising:
- providing a wafer having plurality of dice, each die having an imaging portion and a plurality of bonding pads;
- attaching an optical cover sheet having substantially uniform thickness to the wafer;
- removing portions of the optical cover sheet that overlie the bonding pads to expose the bonding pads on the dice, while leaving portions of the optical cover sheet that overlie the imaging portions of the dice, thereby defining a multiplicity of isolated optical covers;
- dicing the wafer to provide a multiplicity of singulated dice, each singulated die having an associated optical cover;
- mounting a plurality of the singulated dice on a substrate;
- electrically connecting each of the mounted dice to a portion of a the substrate;
- encapsulating the dice, wherein the encapsulant surrounds peripheral edges of the optical cover, but the portion of the optical covers that overlie the imaging portion of their associated die remain unobstructed;
- singulating the substrate to provide a plurality of singulated semiconductor packages;
- and
- removing protective film segments from the singulated semiconductor packages after the singulation step, wherein:
- the optical cover sheet has a removable protective film that is adhesively adhered to a top surface of the optical cover sheet;
- the encapsulation is arranged so that the a top surface of the protective film is substantially co-planar with the top surface of the encapsulant;
- and
- the singulation of the substrate causes each singulated semiconductor package to have an optical cover segment that is covered by a protective film segment.
11 more elements
A method for packaging semiconductor devices comprising:
- providing a plurality of semiconductor dice, each die having an imaging portion, a plurality of bonding pads, and an optical cover that overlies the imaging portion of the die while leaving the bonding pads exposed, wherein the optical cover has a removable protective film that is adhesively adhered to a top surface of the optical cover sheet;
- mounting a plurality of the dice on a substrate;
- electrically connecting each of the mounted dice to a portion of the substrate;
- encapsulating the dice, wherein the encapsulant surrounds peripheral edges of the optical cover, but the portion of the optical covers that overlie the imaging portion of their associated die remain unobstructed;
- singulating the substrate to provide a plurality of singulated semiconductor packages, wherein the singulation of the substrate causes each singulated semiconductor package to have an optical cover segment that is covered by a protective film segment;
- and
- removing protective film segments from the singulated semiconductor packages after the singulation step.
4 more elements
A method for packaging semiconductor devices comprising:
- providing a wafer having plurality of dice, each die having an imaging portion and a plurality of bonding pads;
- attaching an optical cover sheet having a substantially uniform thickness to the wafer, wherein the optical cover sheet has a removable protective film that is adhesively adhered to a top surface of the optical cover sheet;
- removing portions of the optical cover sheet that overlie the bonding pads to expose the bonding pads on the dice, while leaving portions of the optical cover sheet that overlie the imaging portions of the dice, thereby defining a multiplicity of isolated optical covers;
- and
- dicing the wafer to provide a multiplicity of singulated dice, each singulated die having an associated optical cover, wherein the removable protective film remains adhesively adhered to a top surface of the optical cover sheet after the removing step.
2 more elements
Dependencies are inferred from the claim text.