Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same

A method of fabricating a light emitting device having a substrate and a semiconductor light emitting element on the substrate, comprising:

• forming a trench in the substrate adjacent at least a portion of the periphery of the light emitting element, the trench having at least two sidewalls configured to contain a light conversion material and having an opening on a surface of the substrate opposite the light emitting element;
• forming a layer pattern on the substrate outside the trench and adjacent thereto after forming the trench;
• depositing the light conversion material in the trench and directly on sidewalls of the layer pattern;
• and
• removing the layer pattern such that a surface of the deposited light conversion material protrudes outside the trench and beyond the substrate adjacent thereto.

A method of fabricating a light emitting device having a substrate and a semiconductor light emitting element on the substrate, comprising:

• forming a trench in the substrate adjacent at least a portion of the periphery of the light emitting element, the trench having at least two sidewalls configured to contain a light conversion material and a floor therebetween, wherein the at least two sidewalls are tapered sidewalls that extend from the floor of the trench to a surface of the substrate opposite the light emitting element;
• forming a layer pattern on the substrate outside the trench and adjacent thereto after forming the trench;
• depositing the light conversion material in the trench and directly on sidewalls of the layer pattern;
• and
• removing the layer pattern such that a surface of the deposited light conversion material protrudes outside the trench and beyond the substrate adjacent thereto.