Methods of assembly for a semiconductor light emitting device package
AssigneeCree, Inc.
InventorPeter Andrews
Life of this patent
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Abstract
Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a solder material and a flux therebetween. The semiconductor light emitting device is positioned on a top side of the submount with a solder material and a flux therebetween to provide an assembled stack that has not been reflowed. The assembled stack is reflowed to attach the submount to the mounting substrate and the light emitting device to the submount.
Claims22
A method of assembly for a semiconductor light emitting device package, comprising:
- positioning a submount on a mounting substrate with a solder material and a flux therebetween;
- positioning the semiconductor light emitting device on a top side of the submount with a solder material and a flux therebetween to provide an assembled stack that has not been reflowed;
- and
- reflowing the assembled stack to attach the submount to the mounting substrate and the light emitting device to the submount.
A method of assembly for a semiconductor light emitting device package, comprising:
- providing a mounting substrate, a high temperature solder backside terminated submount, a high temperature solder terminated semiconductor light emitting device, a high temperature solder paste and a solder flux to a pick and place assembly apparatus;
- wherein the following operations are performed by the pick and place apparatus:
- dispensing the high temperature solder paste on the mounting substrate;
- placing the submount with a bottom face thereof on the mounting substrate with the dispensed solder paste therebetween;
- dispensing the flux on a top face of the submount;
- placing the light emitting device on the submount with the flux therebetween, the light emitting device having a high temperature solder material deposited on a face thereof contacting the dispensed flux to provide an unsoldered assembled stack;
- and then
- providing the assembled stack for heating in a reflow oven;
- and
- wherein the following operation is performed by the reflow oven:
- reflowing the assembled stack.
Dependencies are inferred from the claim text.