Mirror including dielectric portions and a method of manufacturing the same

A method for manufacturing a microelectronic device, comprising:

• forming a first photoresist spacer layer over a substrate, the first photoresist spacer layer having one or more openings therein;
• forming a hinge structure over the first photoresist spacer layer and within the one or more openings;
• forming a second photoresist spacer layer over the hinge structure, the second photoresist spacer layer having one or more openings therein;
• forming a first mirror layer over the second photoresist spacer layer and within the one or more openings in the second photoresist spacer layer;
• forming a dielectric layer over an upper surface of the first mirror layer and within the one or more openings in the second photoresist spacer layer;
• subjecting the dielectric layer to an etch, the etch removing the dielectric layer from the upper surface of the first mirror layer and leaving dielectric portions along sidewalls of the one or more openings in the second photoresist spacer layer;
• forming a second mirror layer over the first mirror layer and within the one or more openings in the second photoresist spacer layer, the dielectric portions separating the first mirror layer and the second mirror layer along the sidewalls;
• and
• removing the first and second photoresist spacer layers after forming the second mirror layer.

A microelectronic device, comprising:

• a conductive feature;
• a hinge structure located over and contacting the conductive feature, wherein at least a portion of the hinge structure defines a first well;
• and
• a mirror structure located over the hinge structure, the mirror structure including:
• a first mirror layer contacting the hinge structure, wherein at least a portion of the first mirror layer defines a second well;
• dielectric portions located along sidewalls of the second well;
• and
• a second mirror layer located over the first mirror layer and within the second well, the dielectric portions located between the first mirror layer and the second mirror layer along the sidewalls.