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US 7,404,885 B2Granted
Plating method and electronic device
AssigneeSeiko Epson Corporation
InventorsHidemichi Furihata, Satoshi Kimura
Life of this patent
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Abstract
A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active agent layer, and (d) precipitating a metal layer above the catalyst layer.
Claims8
A plating method comprising the steps of:
- (a) forming a roughened area in a predetermined area of a substrate;
- (b) forming a surface-active agent layer above at least the roughened area;
- (c) forming, above the roughened area, a catalyst layer above the surface-active agent layer;
- and
- (d) precipitating a metal layer above the catalyst layer
- wherein the step (a) includes forming another surface-active agent layer on an area other than the predetermined area of the substrate, and etching the substrate by wet-etching to thereby form the roughened area.
3 more elements
Dependencies are inferred from the claim text.