Contactor

A contactor comprising:

• a guide hole for receiving an electrical a contact of a substrate of a semiconductor package;
• and
• a contact spring assembled with
• a neck portion located to come in contact with the electrical contact inserted into the guide hole;
• and
• a leg portion to be electrically connected to a conductor member of a wiring plate,
• wherein the guide hole is opened, with a diameter allowing insertion of the neck portion, through a guide plate arranged in order to move close to and apart from a holder retractably accommodating the contact spring, the neck portion being tightly twisted, projecting out from the holder, and slidably inserted into the guide hole, the holder preventing a body portion of the contact spring from coming out at both ends thereof,
• wherein a support spring urges the guide plate in a backward direction relative to the holder, and
• the guide plate configured to be free from a spring load of the contact spring, and
• wherein the holder bears a spring load of the contact spring, and the holder and the guide plate bear a spring load of the support spring so that the support spring provides a biasing pressure to the guide plate, thereby controlling force applied to the semiconductor package under test by the guide plate contacting therewith, at different biasing pressures from a biasing pressures applied by the neck portion of the contact spring directly contacting on the electrical contact of the substrate of the semiconductor package.

A contactor comprising:

• a contact spring having a leg portion, a body portion and a tightly twisted neck portion adapted, for current conduction, to directly contact on an electrical contact of a device under test;
• a reception hole having a form allowing the leg portion and the neck portion to project out while inhibiting the body portion from coming out at both ends thereof;
• a holder having the reception hole formed therein;
• a float type guide plate having a guide hole configured for the neck portion to be slidably inserted therein at one end thereof and for the electrical contact of the device to be fitted therein at the other end thereof;
• and
• a support spring interposed between the holder and the guide plate,
• wherein the holder bears a spring load of the contact spring, and the holder and the guide plate bear a spring load of the support spring so that the support spring provides a biasing pressure to the guide plate, thereby controlling force applied to a device under test by the guide plate contacting therewith, at different biasing pressures from a biasing pressures applied by the neck portion of the contact spring directly contacting on the electrical contact of the device.

A contactor comprising:

• a guide hole for receiving an electrical a contact of a substrate of a semiconductor package;
• and
• a reception hole for receiving a contact spring assembled with
• a neck portion located to come in contact with the electrical contact inserted into the guide hole, and
• a leg portion to be electrically connected to a conductor member of a wiring plate,
• wherein the guide hole is opened, with a diameter allowing insertion of the neck portion, through a guide plate arranged in order to move relative to a holder retractably accommodating the contact spring, the neck portion being tightly twisted, projecting out from the holder, and slidably inserted into the guide hole, with the guide plate urged by a support spring in a backward direction relative to the holder,
• wherein the reception hole has a form from which the leg portion and the neck portion are allowed to project out, inhibiting a body portion from coming out at both ends thereof, and
• wherein the holder bears a spring load of the contact spring, and the holder and the guide plate bear a spring load of the support spring so that the support spring provides a biasing pressure to the guide plate, thereby controlling force applied to the semiconductor package under test by the guide plate contacting therewith, at different biasing pressures from a biasing pressures applied by the neck portion of the contact spring directly contacting on the electrical contact of the substrate of the semiconductor package.