Contactor having contact electrodes of metal springs embedded in a plate-like structure

A contactor configured to be arranged between a semiconductor device and a test board to as to contact the semiconductor device to the test board, the contactor comprising:

• a plate-like substrate formed of an insulating material, the substrate having a first surface facing said semiconductor device and a second surface facing said test board;
• and
• a plurality of contact electrodes embedded and fixed in the substrate,
• wherein each of said contact electrodes has a first end portion, a second end portion and a conductive portion between the first end portion and second end portion, the first end portion protruding from a first surface of said substrate, the second end portion protruding from a second surface of said substrate, and said substrate and said conductive portion are deformable in a direction of a thickness of said substrate;
• and
• wherein a first coating layer is formed on said first surface of said substrate, the first coating layer having a thermal expansion coefficient substantially equal to that of a substrate of said semiconductor device, and the first end portion of said contact electrode protrudes from said first coating layer.

A contactor configured to be arranged between a semiconductor device and a test board so as to contact the semiconductor device to the test board, the contactor comprising:

• a plate-like substrate formed of an insulating material, the substrate having a first surface said semiconductor device and a second surface facing said test board;
• and
• a plurality of contact electrodes embedded and fixed in the substrate;
• wherein each of said contact electrodes has a first end portion, a second end portion and a conductive portion between the first end portion and second end portion, the first end portion protruding from a first surface of said substrate, the second end portion protruding from a second surface of said substrate, and said substrate and said conductive portion are deformable in a direction of a thickness of said substrate;
• and wherein a second coating layer is formed on said second surface of said substrate, the second coating layer having a thermal expansion coefficient substantially equal to that of said test board, and the second end portion of said contact electrode protrudes from said second coating layer.