Solder, microelectromechanical component and device, and a process for producing a component or device
AssigneesMicropelt GmbH, Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsHarald Böttner, Axel Schubert, Martin Jaegle
Life of this patent
Estimating the term…
Abstract
A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.
Claims12
A microelectromechanical component having at least one soldering layer for joining to at least one further component, which component includes at least one soldering layer made from a solder comprising a eutectic mixture of gold and bismuth and a bismuth layer for producing a soldered joint with to a gold layer.
A microelectromechanical device, wherein a soldered joint including a solder comprising a eutectic mixture of gold and bismuth joins at least two components, at least one component comprises at least two substrates joined together by said solder, and each substrate has a thermoelectric material facing the other substrate arranged thereon, wherein an orientation of a layer arrangement of the thermoelectric material and the solder of each of the at least two substrates is alternatingly spaced between the thermoelectric material of the other of the at least two substrates.
Dependencies are inferred from the claim text.